Batch Plasma Substrate Processing Apparatus with Segmented Electrodes
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Solution Overview
Problem
Batch-type plasma substrate processing apparatuses face challenges in uniform heating of multiple substrates, leading to temperature gradients and prolonged reaction times, and the use of single RF power for plasma formation results in high-energy ionized particles that can damage equipment and generate unwanted particles.
Innovation Solution
A batch-type plasma substrate processing apparatus with a separate plasma reaction part, featuring multiple power supply electrode parts and a ground electrode, uses a three-electrode structure and capacitively coupled plasma to reduce RF power requirements, and a ceramic tube to protect electrodes, while decomposing process gas outside the processing space to minimize particle generation and ensure uniform gas distribution.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If single RF power is applied to form plasma in the processing space, then plasma formation is achieved, but high-energy ionized particles are generated that can damage equipment and generate unwanted particles
Solution Approach 1:
The plasma generation function is segmented from the processing space. Multiple power supply electrode parts are distributed around the processing space, each generating plasma locally. This segmentation prevents concentrated high-energy particle generation while maintaining effective plasma treatment across all substrates.
Solution Approach 2:
The plasma generation function is extracted from the processing space and relocated to a separate plasma generation space. Process gas is decomposed in this separate space, and only the decomposed gas is supplied into the processing space, preventing high-energy ionized particles from directly contacting substrates and equipment.
2Reliability
If high power is applied to obtain required amount of radicals, then plasma formation is stable, but ionized particles have high energy that damages pipes and tubes
Solution Approach 1:
The plasma generation is segmented into multiple localized zones around the processing space. Each power supply electrode part generates plasma with moderate power, achieving stable radical generation without the need for concentrated high power that would damage equipment.
Solution Approach 2:
The high-power plasma generation process is extracted from the processing space and performed in a separate plasma generation space. This allows high power to be applied safely for radical generation, with only the decomposed gas (not the high-energy plasma particles) entering the processing space.
3Productivity
If plasma is formed in the processing space to promote ionization and chemical reaction, then reaction temperature and time are decreased, but particle generation and equipment damage occur
Solution Approach 1:
The plasma generation function is extracted from the processing space and performed in a separate plasma generation space. This extraction maintains the productivity benefits of plasma (decomposed gas supply) while eliminating the harmful effects of high-energy particles in the processing space.
Solution Approach 2:
The process gas acts as an intermediary medium. It is decomposed in the plasma generation space and then supplied into the processing space as decomposed process gas. This intermediary approach transfers the beneficial chemical decomposition effects while filtering out the harmful high-energy plasma particles.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration reduces the power needed for plasma formation, prevents equipment damage, and ensures uniform plasma generation and gas distribution, improving the quality and efficiency of the substrate processing by maintaining low electron temperatures and reducing unwanted particle generation.
Implementation Method 1
a plasma reaction part which extends from the tube, is separated from the processing space by a separation wall configured to define a discharge space in which plasma is formed, and plasma-decomposes the process gas supplied from the gas supply pipe
Implementation Method 2
The plurality of power supply electrode parts and the ground electrode part may be spaced apart from each other and electrically separated, and the plasma may be capacitively coupled plasma (CCP)
Implementation Method 3
a plurality of variable capacitors respectively provided between the power supply part and the plurality of power supply electrode parts
Data Source
AI summary
Provided is a batch-type substrate processing apparatus which supplies, into a processing space, a process gas decomposed in a separate space. The substrate processing apparatus includes: a tube; a substrate support part; a gas supply pipe; an exhaust part; and a plasma reaction part, wherein the plasma part may include a plurality of power supply electrode parts and a ground electrode part.