Batch Substrate Support for Warped Wafer Degassing Throughput
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Solution Overview
Problem
Conventional semiconductor substrate processing technologies often require multiple degassing chambers to process multiple substrates simultaneously, which is costly and inefficient, as they typically handle substrates one at a time, leading to contamination and reduced quality due to residual gases.
Innovation Solution
A batch substrate support system that includes a plurality of substrate support elements and lift elements, allowing for simultaneous and controlled positioning of multiple substrates within a processing chamber, enabling full 360-degree backside contact and efficient batch substrate transfer with a substrate transfer robot, while maintaining accessibility for transfer blades on multiple sides.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If multiple degassing chambers are provided to process multiple substrates simultaneously, then throughput is improved, but cost and device complexity increase
Solution Approach 1:
The patent combines multiple substrate processing functions into a single degassing chamber by implementing a vertical stacking arrangement where multiple substrates are positioned at different heights on support elements. This merging approach allows batch processing of multiple substrates simultaneously without requiring multiple separate chambers, thereby improving throughput while avoiding the cost and complexity of multiplying chamber structures.
Solution Approach 2:
The patent transitions from horizontal arrangement of substrates in separate chambers to a vertical three-dimensional arrangement within a single chamber. By utilizing the vertical dimension with adjustable support elements that can position substrates at different heights, the system achieves batch processing capability without expanding the horizontal footprint or requiring multiple chambers, thus resolving the contradiction between productivity and device complexity.
2Device complexity
If substrates are processed one at a time, then device complexity is reduced, but productivity and throughput decrease
Solution Approach 1:
The patent implements dynamic adjustable support elements that can independently position multiple substrates at different vertical locations within the chamber. This dynamic capability allows the system to accommodate various batch sizes and configurations without requiring complex fixed structures, enabling efficient single-chamber batch processing that improves throughput while maintaining manageable device complexity.
3Productivity
If substrates are vertically stacked for batch processing, then productivity is improved, but accessibility for transfer blades may be limited
Solution Approach 1:
The patent employs dynamically adjustable support elements that can move substrates between different vertical positions. This dynamic positioning capability ensures that substrates can be accessed by transfer blades from multiple sides while maintaining vertical stacking for batch processing, thus resolving the contradiction between productivity improvement through vertical arrangement and operational ease through accessibility.
Data Source
AI summary
Methods and apparatus for supporting substrates are provided herein. In some embodiments, a substrate support for supporting a plurality of substrates includes: a plurality of substrate support elements having a ring shape configured to support a plurality of substrates in a vertically spaced apart relation; and a plurality of substrate lift elements interfacing with the plurality of substrate support elements and configured to simultaneously selectively raise or lower substrates off of or onto respective substrate support elements.