Substrate Transport Chamber Layout for Faster Batch Wafer Handling

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Solution Overview

Problem

Current batch-type substrate processing apparatuses face inefficiencies in transporting substrates to process chambers, leading to prolonged processing times due to the need for individual substrate handling and transfer.

Innovation Solution

The apparatus includes multiple process chambers, supports, a transporter, a transfer chamber, and a delivery chamber, allowing for simultaneous handling and transfer of multiple substrates using a transporter that moves along rails, with a controller managing the process to optimize substrate movement and processing.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If a batch-type substrate processing apparatus transports substrates individually to process chambers, then each substrate can be processed, but the transport time becomes excessively long

Engineering Contradiction:
Improvesubstrate processing throughputVSAvoidtransport time
Core Design Contradiction:
ProductivityVSLoss of time

Solution Approach 1:

Multiple substrates are combined on a single substrate support stage, allowing them to be transported and processed simultaneously rather than individually. This merging approach directly reduces transport time while maintaining processing capability for multiple substrates.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The system maintains continuous substrate processing by having multiple substrate support stages in the transport chamber that can be processed in parallel. While one stage is being processed, other stages are being prepared or transported, eliminating idle time and maintaining continuous productive action.

Inventive Principle:
Principle #20Continuity of useful action

2Productivity

If multiple substrate support stages are placed in the transport chamber, then transport efficiency improves, but the device complexity increases

Engineering Contradiction:
Improvetransport efficiencyVSAvoidtransport chamber configuration
Core Design Contradiction:
ProductivityVSDevice complexity

Solution Approach 1:

The transport chamber is segmented into multiple independent substrate support stages, each capable of holding and transporting substrates independently. This segmentation allows parallel processing while maintaining modular simplicity, as each stage operates independently rather than requiring complex interconnections.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

Each substrate support stage is designed to be universal and multi-functional, capable of holding multiple substrates and being processed in different process chambers. This universality reduces the need for specialized components for each stage, thereby reducing overall device complexity while maintaining high productivity.

Inventive Principle:
Principle #6Universality (Multi-functionality)

Data Source

PatentUS11869790B2Substrate processing apparatus, method of manufacturing semiconductor device, and recording medium
Publication Date: 2024.01.09 KOKUSAI DENKI KK
  • US11869790B2 patent drawing
  • US11869790B2 patent drawing
  • US11869790B2 patent drawing

AI summary

There is provided a technique that includes: at least one process chamber configured to be capable of processing a substrate; one or more supports configured to be capable of supporting the substrate; a transporter configured to be capable of transporting the one or more supports; a transfer chamber configured to be capable of transferring the substrate; a transport chamber that is adjacent to the transfer chamber and the at least one process chamber and is configured to be capable of moving the transporter; and a delivery chamber that is disposed in the transport chamber and is configured to be capable of delivering the one or more supports.