Battery-Connected Circuit Board Layout for Thinner Battery Assemblies
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Solution Overview
Problem
Existing circuit boards increase the thickness of devices when matched with batteries, hindering the increase of battery capacity and overall device thickness reduction.
Innovation Solution
A battery-connected circuit board design featuring a substrate with conductive layers on both sides of a first area and a single conductive layer on a second area, connected via insulating cover films and base layers, allowing for reduced overall thickness when matched with a battery without increasing impedance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of moving object
If a traditional circuit board with conductive layers on both sides is used, then electrical connectivity is ensured, but the device thickness increases
Solution Approach 1:
The circuit board is divided into a first area and a second area with different conductive layer configurations. The first area has conductive layers on both sides for full connectivity, while the second area has conductive layers on only one side, reducing thickness in that region while maintaining necessary electrical connections through the substrate.
Solution Approach 2:
Different regions of the circuit board are designed with different structural characteristics. The first area maintains traditional double-sided conductive layer structure where full connectivity is needed, while the second area uses single-sided conductive layers where thickness reduction is prioritized, optimizing both connectivity and thickness locally.
2Length of moving object
If the circuit board thickness is reduced to decrease device thickness, then device thickness decreases, but manufacturing complexity increases
Solution Approach 1:
The manufacturing process is segmented into different stages for different areas of the board. Conductive layers are formed on both sides for the first area and on one side only for the second area, allowing selective thickness reduction while maintaining manufacturability through standardized processes applied to different regions.
Solution Approach 2:
The manufacturing approach applies different layer formation strategies to different areas: complete double-sided lamination and conductive layer deposition for the first area, and simplified single-sided processing for the second area, balancing manufacturing ease with thickness reduction goals.
Data Source
AI summary
A battery-connected circuit board, a battery assembly, and an electronic device are provided. The battery-connected circuit board includes a substrate. The substrate is an insulator, and the substrate includes a first area part and a second area part. First conductive layers are disposed on surfaces on both sides of the first area part. A second conductive layer is disposed on a surface on one side of the second area part. The second conductive layer is electrically connected to one of the first conductive layers that is on a same side as the second conductive layer.