Secondary Battery Cap Assembly Without Riveting
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Solution Overview
Problem
The manufacturing process of cap assemblies for secondary batteries is complex and time-consuming due to the assembly and riveting of separate components, which can lead to physical damage and increased process time.
Innovation Solution
A cap assembly is designed with a lower and upper conductive plate, and lower and upper resin layers that are integrally combined through a molding process, using different resin compositions at varying temperatures and pressures to form a single structure, eliminating the need for riveting.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If components are manufactured separately and assembled with riveting, then the cap assembly can be formed with distinct functional parts, but the manufacturing process becomes complex and time-consuming
Solution Approach 1:
The patent combines multiple separate components (cap plate, conductor, terminal plate, bottom insulating film, and gasket) into a single integrated cap assembly structure. This is achieved by forming the insulating film and resin layers that bond all components together as one unified structure, eliminating the need for separate assembly and riveting operations.
Solution Approach 2:
The patent replaces the mechanical riveting process with a chemical bonding approach. Instead of using rivets to mechanically fasten components, the invention uses resin layers and insulating films that chemically bond the components together, simplifying the manufacturing process and reducing assembly time.
2Reliability
If components are assembled and fixed by riveting, then the cap assembly can be constructed with complex-shaped parts, but physical damage occurs during the riveting process
Solution Approach 1:
The patent replaces the mechanical riveting process with a chemical bonding approach. Instead of using rivets that cause physical damage, the invention uses resin layers and insulating films that chemically bond the components together, eliminating physical damage during assembly.
Solution Approach 2:
The patent changes the bonding mechanism from mechanical (riveting) to chemical (resin bonding). This parameter change in the joining method eliminates the harmful mechanical stresses and physical damage associated with riveting while maintaining strong component attachment.
3Adaptability or versatility
If multiple components are assembled separately, then each component can be optimized for its specific function, but the overall assembly process becomes sophisticated and complex
Solution Approach 1:
The patent combines multiple functionally-optimized components into a single integrated structure. The cap plate, conductor, terminal plate, insulating film, and gasket are all formed as one unified cap assembly, maintaining the specific functional optimization of each component while eliminating the complexity of assembling them separately.
Solution Approach 2:
The integrated cap assembly structure serves multiple functions simultaneously. The insulating film and resin layers not only provide electrical insulation but also mechanically bond all components together, replacing multiple separate assembly operations with a single multi-functional bonding process.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method reduces process difficulty and time, improves product reliability, and enhances manufacturing efficiency by integrating the components into a single structure, allowing for faster assembly and improved fastening to electrode modules.
Implementation Method 1
forming an upper resin layer by injecting a first resin composition between the lower conductive plate and the upper conductive plate while maintaining the mold at a first temperature
Implementation Method 2
forming a lower resin layer by injecting a second resin composition below the lower conductive plate while maintaining the mold at a second temperature
Data Source
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AI summary
Disclosed are a cap assembly, a secondary battery including the cap assembly, and a method of manufacturing the cap assembly. The disclosed cap assembly and secondary battery can be made by the disclosed methods that reduce process difficulty and the process time, and provide improved cap assembly reliability. The cap assembly includes a lower conductive plate, an upper conductive plate disposed above the lower conductive plate, a lower resin layer fused to a bottom surface of the lower conductive plate, and an upper resin layer fused to a top surface of the lower conductive plate, a bottom surface of the upper conductive plate, or the top surface of the lower conductive plate and the bottom surface of the upper conductive plate.