Battery Pack Case Bonding With Jig-Flattened Bottom Cooling
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing battery pack designs face challenges in achieving high flatness of the case bottom portion during press processing, leading to increased thermal resistance and decreased cooling performance due to uneven adhesive application and thick adhesive layers.
Innovation Solution
A method involving the use of a jig with magnetic or vacuum adsorption to temporarily improve the flatness of the case bottom, allowing for thin adhesive application and improved cooling performance by maintaining the flatness of the plate-shaped member bonding.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If the case bottom portion is press-processed without additional flatness control, then the manufacturing process is simple, but the flatness of the bottom portion becomes poor leading to thick adhesive layers
Solution Approach 1:
The jig performs preliminary flatness correction on the case bottom portion before adhesive application. By bringing the bottom portion into close contact with the jig's flat surface and applying pressing force, the unevenness is corrected in advance, ensuring a flat surface for subsequent adhesive bonding without requiring complex post-processing
Solution Approach 2:
The jig acts as an intermediary tool between the press processing and adhesive application stages. It provides a flat reference surface that temporarily holds the case bottom portion in a flattened state during the critical adhesive application phase, enabling precise bonding without direct integration into the press mold
2Reliability
If adhesive is applied to fill uneven portions of the case bottom, then the unevenness is covered, but the adhesive layer becomes thick increasing thermal resistance
Solution Approach 1:
The jig corrects the unevenness of the case bottom portion before adhesive application by providing a flat pressing surface. This preliminary flatness correction ensures that when adhesive is applied, it forms a thin uniform layer rather than thick layers needed to fill gaps, thereby maintaining low thermal resistance while ensuring reliable bonding
Solution Approach 2:
The pressing force applied through the jig changes the physical state of the case bottom portion from uneven to flat. This parameter change in surface geometry allows for optimized adhesive thickness control, reducing the adhesive layer thickness from what would be needed to fill gaps to a thin uniform layer that maintains thermal efficiency
3Manufacturing precision
If the case bottom portion is pressed flat during adhesive application, then good flatness is achieved for thin adhesive layers, but the process requires additional steps
Solution Approach 1:
The jig combines multiple functions into a single tool: it provides flatness correction, serves as an adhesive application surface, and maintains the flattened state during bonding. This merging of functions into one integrated device achieves high flatness and thin adhesive layers without requiring separate correction and bonding steps, thereby maintaining manufacturing efficiency
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Maintains good flatness of the case bottom portion, reducing adhesive thickness and thermal resistance, thereby enhancing cooling performance and reducing costs.
Implementation Method 1
A method involving the use of a jig with magnetic or vacuum adsorption to temporarily improve the flatness of the case bottom
Implementation Method 2
A method involving the use of a jig with magnetic or vacuum adsorption to temporarily improve the flatness of the case bottom
Data Source
AI summary
A method of manufacturing a battery pack including a molding step of molding a case that accommodates a battery, in which the molding step includes a step of bringing a bottom portion of a lower case into close contact with a jig to cause the bottom portion to have a flat plate shape and a step of bonding a cooler to a lower surface of the lower case in a state where the bottom portion of the lower case is brought into close contact with the jig.