Battery Circuit Board with Conductive Coating for Heat Dissipation
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Solution Overview
Problem
Existing battery circuit boards fail to effectively distribute electric current and heat evenly, leading to local thermal hotspots that can impair battery operation, and lack efficient heat dissipation mechanisms.
Innovation Solution
A circuit board design featuring a non-electrically conductive substrate with electrically and thermally conductive contact sections on both sides, connected via conductive feedthrough elements, and a conductive coating for heat dissipation, using materials like copper or aluminum for enhanced conductivity and weight reduction.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a metallic core is used in the circuit board to improve thermal conductivity, then heat dissipation is improved, but the weight of the circuit board increases
Solution Approach 1:
The circuit board uses a composite structure combining a non-conductive substrate (epoxy resin or polyimide) with conductive contact sections and feedthrough elements made of metal materials. This composite approach provides both thermal conductivity where needed and weight reduction overall, avoiding the need for a fully metallic core while still achieving effective heat dissipation through the conductive contact sections and feedthrough elements.
2Reliability
If electrically conductive materials are used for contact sections, then electrical conductivity is improved, but thermal conductivity may be compromised
Solution Approach 1:
The circuit board features contact sections and feedthrough elements made of electrically and thermally conductive metal materials (such as copper or aluminum) that are selectively applied to specific locations where electrical and thermal conduction is required. The bulk substrate remains non-conductive (epoxy resin or polyimide), providing electrical insulation while allowing the localized conductive elements to handle both electrical current and heat dissipation effectively.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design ensures even distribution of electric and thermal currents, prevents thermal hotspots, and effectively dissipates heat through a conductive coating, improving battery performance and reducing weight by using lightweight metals.
Implementation Method 1
a flow of heat can be absorbed by the coating and dissipated from the circuit board
Implementation Method 2
the covering is thermally conductively connected to a thermally conductive heat dissipation element
Implementation Method 3
an electrical and a thermal connection of the contacting sections on the first side with the contacting sections of the second side is produced by the feedthrough element
Implementation Method 4
each contact section connected to each other contacting section is electrically and thermally conductively connected
Data Source
Figure 1~2
Figure 3~4
Figure 5~6
AI summary
The invention relates to a circuit board (1) for connecting battery cells, which circuit board is formed partly of an electrically nonconductive material, wherein the circuit board (1) has at least one electrically and thermally conductive contacting section (7) on a first side (2) and on a second side, and wherein every contacting section (7) is connected to every other contacting section (7) in an electrically and thermally conductive manner. According to the invention, a planar covering (12) of an electrically and thermally conductive material is arranged on the electrically nonconductive material of the circuit board (1), which covering forms the second side, wherein at least one section of the covering (12) forms a contacting section (7) of the second side and wherein at least one contacting section (7) is arranged on a first side (2) of the electrically nonconductive material facing away from the covering (12), and wherein at least one electrically and thermally conductive feed-through element (17) extends through the electrically nonconductive material such that an electrical and a thermal connection of the contacting sections (7) on the first side (2) to the contacting sections (7) on the second side is established by means of the feed-through element (7) and a heat flow can be absorbed by the covering (12) and can be led away from the circuit board (1).