Battery Cover Plate Assembly With Embedded Chip Fixing

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Solution Overview

Problem

The existing power battery safety systems face issues with the chip used for monitoring the battery's internal status being easily loosened and separated due to loose connections via wiring harnesses, leading to instability and reduced reliability.

Innovation Solution

A cover plate assembly with an insulating plate that incorporates a chip embedding hole to securely fix the chip, enhancing the connection between the chip and the cover plate assembly, and includes a chip fixing buckle for additional stability.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If the chip is fixed through a wiring harness in a battery, then the chip can monitor internal status changes, but the chip becomes easily loosened and separated

Engineering Contradiction:
Improvechip connection reliabilityVSAvoidchip positioning stability
Core Design Contradiction:
ReliabilityVSStability of the object's composition

Solution Approach 1:

The insulating plate is segmented to include a dedicated chip embedding hole, separating the chip mounting function from the wiring harness connection. This segmentation allows the chip to be embedded in a fixed position on the insulating plate, eliminating the loosening issue while maintaining monitoring functionality.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The chip is nested within the chip embedding hole of the insulating plate, creating a nested structure where the chip is housed inside a dedicated cavity. This nesting provides secure positioning and prevents loosening, while the insulating plate itself is nested in the battery assembly.

Inventive Principle:
Principle #7Nested doll (Nesting)

2Reliability

If the chip is embedded in the insulating plate with a chip fixing buckle, then the connection becomes tighter and more stable, but the structure becomes more complex

Engineering Contradiction:
Improvechip fixing reliabilityVSAvoidcover plate assembly complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The chip fixing buckle is merged with the insulating plate as an integrated component rather than a separate part. The buckle is formed directly on the insulating plate to engage with the chip, combining two functions (insulation and chip fixing) into one component, thereby reducing overall assembly complexity while improving reliability.

Inventive Principle:
Principle #5Merging (Combining)

3Stability of the object's composition

If the chip embedding hole is provided on the insulating plate, then the structure compactness is improved, but the manufacturing precision requirements increase

Engineering Contradiction:
Improvestructural integrationVSAvoidchip embedding hole precision
Core Design Contradiction:
Stability of the object's compositionVSManufacturing precision

Solution Approach 1:

The chip embedding hole is designed with optimized dimensional parameters (depth, diameter, position) that balance structural integration needs with manufacturing capabilities. By carefully selecting these parameters, the design achieves good structural compactness while remaining feasible for standard manufacturing processes.

Inventive Principle:
Principle #35Parameter changes

Data Source

PatentEP4618232A1Cover plate assembly, battery, energy storage device, and power consuming device
Publication Date: 2025.09.17 BYD CO LTD
  • EP4618232A1 patent drawingFigure 1~3
  • EP4618232A1 patent drawingFigure 4~5
  • EP4618232A1 patent drawingFigure 6~7

AI summary

A cover plate assembly, a battery, an energy storage device, and a power consuming device. The cover plate assembly includes a cover plate and an insulating plate. The insulating plate is arranged on a side of the cover plate, a terminal hole for a terminal to pass through is provided on the cover plate and the insulating plate, and a chip embedding hole for fixing a chip is provided on the insulating plate. In the cover plate assembly according to embodiments of the present disclosure, the chip embedding hole is provided on the insulating plate, so that the chip can be fixed in the chip embedding hole. Therefore, connection between the chip and the insulating plate becomes tighter, and connection between the chip and the cover plate assembly becomes tighter, thereby reducing looseness and displacement of the chip, helping improve the stability and reliability of function operation of the chip, and helping improve the structure compactness of the cover plate assembly.