Battery Disconnect Unit Cooling for Solid-State Relay Heat

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Solution Overview

Problem

Conventional battery disconnect units using electro-mechanical relays suffer from issues such as contact welding, high power consumption, heat generation, large size, weight, and high failure rates, while electronic relays face damage due to inadequate heat management.

Innovation Solution

A battery disconnect unit incorporating an electronic relay module with a heat dissipation cover and cooling plate, utilizing a refrigerant system to manage heat effectively, thereby preventing contact welding and reducing size and weight.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If electro-mechanical relays are used in the battery disconnect unit, then the relays can effectively control high current, but contact welding and high failure rates occur

Engineering Contradiction:
Improverelay reliabilityVSAvoidcontact welding
Core Design Contradiction:
ReliabilityVSObject-affected harmful factors

Solution Approach 1:

The patent replaces electro-mechanical relays with solid-state electronic relays that use semiconductor devices (MOSFETs or IGBTs) instead of mechanical moving parts and contacts. This substitution eliminates contact welding issues while maintaining the ability to control high current, directly resolving the contradiction between reliability and contact welding prevention.

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

2Device complexity

If electro-mechanical relays are used, then the relay structure is simple, but the size and weight are large

Engineering Contradiction:
Improverelay structureVSAvoiddisconnect unit weight
Core Design Contradiction:
Device complexityVSWeight of moving object

Solution Approach 1:

By replacing heavy mechanical components with lightweight semiconductor devices, the patent achieves significant weight reduction while simplifying the overall structure. The solid-state electronic relays eliminate the need for heavy magnetic coils, springs, and contact mechanisms, directly addressing the weight and complexity contradiction.

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

3Power

If electro-mechanical relays are used, then the relay can handle high current, but power consumption and heat generation are high

Engineering Contradiction:
Improvecurrent handling capabilityVSAvoidpower consumption
Core Design Contradiction:
PowerVSUse of energy by moving object

Solution Approach 1:

The patent replaces energy-intensive electro-mechanical relays with efficient solid-state switches that consume minimal power during operation. The semiconductor devices maintain high current handling capability while dramatically reducing power consumption and heat generation, resolving the contradiction between power handling and energy efficiency.

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

4Weight of moving object

If electronic relays are used to reduce size and weight, then the disconnect unit becomes more compact, but heat management becomes critical

Engineering Contradiction:
Improvedisconnect unit weightVSAvoidelectronic relay temperature
Core Design Contradiction:
Weight of moving objectVSTemperature

Solution Approach 1:

The patent introduces a heat dissipation cover as an intermediary component between the electronic relay module and the cooling system. This cover efficiently transfers heat from the electronic relays to the cooling plate, enabling effective thermal management in the compact design and resolving the temperature management challenge.

Inventive Principle:
Principle #24Intermediary (Mediator)

5Temperature

If a cooling device is added to manage electronic relay heat, then temperature control is achieved, but device complexity increases

Engineering Contradiction:
Improveelectronic relay temperatureVSAvoidcooling system complexity
Core Design Contradiction:
TemperatureVSDevice complexity

Solution Approach 1:

The patent merges the cooling function with the housing structure by integrating the cooling plate and heat dissipation cover into the existing disconnect unit design. This consolidation achieves effective temperature control while minimizing additional complexity, as the cooling components share space and structural elements with the housing rather than adding separate systems.

Inventive Principle:
Principle #5Merging (Combining)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution ensures reliable operation of electronic relays by managing heat effectively, preventing contact welding, and reducing the size and weight of the disconnect unit compared to conventional units.

Implementation Method 1

a cooling plate disposed in contact with the heat dissipation cover and configured to allow a refrigerant to flow in the cooling plate

Methodology Applied
Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 2

allow a refrigerant to flow in the cooling plate

Methodology Applied
Scientific EffectConvection: Convection

Implementation Method 3

a heat dissipation cover surrounding at least a portion of the electronic relay module and formed of a material capable of heat exchange with the electronic relay module

Methodology Applied
Scientific EffectHeat exchange: Heat Exchanger

Data Source

PatentUS12557253B2Battery disconnect unit
Publication Date: 2026.02.17 LG ENERGY SOLUTION LTD
  • US12557253B2 patent drawing
  • US12557253B2 patent drawing
  • US12557253B2 patent drawing

AI summary

A battery disconnect unit including a housing, an electronic relay module installed on a charge/discharge line of a battery within the housing and including electronic switch devices capable of a switching operation of selectively blocking the flow of a current in the charge/discharge line, a heat dissipation cover provided with a structure surrounding at least a portion of the electronic relay module and formed of a material capable of heat exchange with the electronic relay module, and a cooling plate disposed in contact with the heat dissipation cover and provided to allow a refrigerant to flow in the cooling plate.