Dual Liquid Cooling Plate Layout for Battery Heat and Insulation

Resolve Bottlenecks,
Find Innovative Solutions
Generate Solutions

Solution Overview

Problem

Existing thermal management systems for power batteries fail to simultaneously achieve effective heat dissipation and thermal insulation, leading to inefficient energy consumption and compromised battery performance, especially in high-power charging and discharging scenarios.

Innovation Solution

A thermal management apparatus with a dual-loop system, utilizing solenoid valves and liquid cooling plates, which can switch between heat dissipation and thermal insulation modes by connecting or disconnecting liquid cooling plates and incorporating a thermal insulation structure like silica aerogel, allowing for adaptive management of heat transfer based on temperature conditions.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If a single-loop cooling system is used for heat dissipation, then heat dissipation efficiency is improved, but thermal insulation capability deteriorates

Engineering Contradiction:
Improveheat dissipation efficiencyVSAvoidthermal insulation capability
Core Design Contradiction:
TemperatureVSAdaptability or versatility

Solution Approach 1:

The single cooling loop is segmented into two independent loops: a first loop for heat dissipation and a second loop for thermal insulation. This allows the system to independently control heat dissipation and thermal insulation functions, resolving the contradiction between heat dissipation efficiency and thermal insulation capability

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The system dynamically switches between different operational modes by controlling solenoid valves to connect or disconnect the first and second loops. This dynamic configuration allows the system to adapt to varying thermal management requirements, achieving both effective heat dissipation when needed and thermal insulation when needed

Inventive Principle:
Principle #15Dynamics

2Adaptability or versatility

If thermal insulation measures are applied, then thermal insulation capability is improved, but heat dissipation efficiency deteriorates

Engineering Contradiction:
Improvethermal insulation capabilityVSAvoidheat dissipation efficiency
Core Design Contradiction:
Adaptability or versatilityVSTemperature

Solution Approach 1:

The cooling system is divided into two separate loops with independent thermal insulation structures. The second loop is specifically designed for thermal insulation and can be activated independently without affecting the heat dissipation function of the first loop

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

Thermal insulation structures are introduced as intermediary elements between the cooling system and the external environment. These structures can be selectively activated to provide thermal insulation when needed, while the heat dissipation loop remains unaffected

Inventive Principle:
Principle #24Intermediary (Mediator)

3Adaptability or versatility

If dual-loop system with solenoid valves is implemented, then adaptability for both heat dissipation and thermal insulation is improved, but device complexity increases

Engineering Contradiction:
Improvethermal management adaptabilityVSAvoidsystem structure complexity
Core Design Contradiction:
Adaptability or versatilityVSDevice complexity

Solution Approach 1:

The dual-loop system is designed with shared components and control mechanisms that can serve multiple functions. The solenoid valves and control unit can manage both heat dissipation and thermal insulation operations, reducing the overall system complexity despite the dual-loop configuration

Inventive Principle:
Principle #6Universality (Multi-functionality)

Solution Approach 2:

The first loop and second loop are merged into a unified thermal management system with common control logic and integrated structure. This merging allows the system to achieve high adaptability while minimizing the increase in device complexity through shared resources

Inventive Principle:
Principle #5Merging (Combining)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The system efficiently manages heat dissipation and insulation, enhancing battery performance and reducing energy consumption by dynamically adjusting heat transfer paths and using external airflow or cooling systems as needed, thereby maintaining optimal battery conditions across varying temperatures.

Implementation Method 1

the first liquid cooling plate can perform heat transfer with the electronic device

Methodology Applied
Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 2

a thermal insulation structure. The second liquid cooling plate, the thermal insulation structure, and the first liquid cooling plate are sequentially stacked

Methodology Applied
Scientific EffectThermal insulation: Thermal Insulation

Implementation Method 3

a first solenoid valve, a first liquid cooling plate, a second solenoid valve, and a second liquid cooling plate are sequentially connected in series

Methodology Applied
Scientific EffectSolenoid actuation: Solenoid

Data Source

PatentEP3913728B1Thermal management device, thermal management system and new energy vehicle
Publication Date: 2024.03.20 HUAWEI DIGITAL POWER TECH CO LTD
  • EP3913728B1 patent drawingFigure 1
  • EP3913728B1 patent drawingFigure 2
  • EP3913728B1 patent drawingFigure 3

AI summary

Embodiments of this application disclose a thermal management apparatus, a thermal management system, and a new energy vehicle, to perform thermal management on an electronic device and meet both a heat dissipation requirement and a thermal insulation requirement of the electronic device. The thermal management apparatus includes a first loop in which a first solenoid valve, a first liquid cooling plate, a second solenoid valve, and a second liquid cooling plate are sequentially connected in series, and a thermal insulation structure. The second liquid cooling plate, the thermal insulation structure, and the first liquid cooling plate are sequentially stacked. The first liquid cooling plate can perform heat transfer with the electronic device. When the first solenoid valve and the second solenoid valve are closed, the first liquid cooling plate communicates with the second liquid cooling plate. When the first solenoid valve and the second solenoid valve are open, the first liquid cooling plate and the second liquid cooling plate are disconnected.