Battery Pack Heat Management Layout for Circuit Board Isolation

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Solution Overview

Problem

Current battery packs with adjacent cells and control components lack effective thermal isolation and fire prevention, leading to rapid heat and flame transmission, which can cause serious accidents such as continuous burning and explosions.

Innovation Solution

A battery pack with a heat management apparatus that includes thermal isolation plates between the cell assembly and circuit board, and thermally conductive plates to manage heat distribution, ensuring effective heat dissipation and fire prevention by reducing heat transmission between components.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Volume of moving object

If cells and control component are arranged adjacent to each other with small gaps, then the battery pack structure is compact, but heat transmits directly through air causing rapid combustion spread

Engineering Contradiction:
Improvebattery pack volumeVSAvoidheat transmission
Core Design Contradiction:
Volume of moving objectVSObject-affected harmful factors

Solution Approach 1:

The patent introduces thermal isolation plates as intermediary components between adjacent cells and between cells and the control component. These plates are made of heat-resistant materials that block direct heat transmission paths, preventing rapid combustion spread while maintaining the compact battery pack structure.

Inventive Principle:
Principle #24Intermediary (Mediator)

Solution Approach 2:

The patent uses composite material structures combining thermal isolation plates with heat dissipation components. The thermal isolation plates are made of heat-resistant materials that provide both structural support and thermal barrier functions, creating a multi-functional composite structure that addresses both compactness and heat management requirements.

Inventive Principle:
Principle #40Composite materials

2Reliability

If thermal isolation plates are added between cells and control component, then fire prevention is improved, but device complexity increases

Engineering Contradiction:
Improvefire preventionVSAvoidheat management apparatus complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The thermal isolation plates are designed to serve multiple functions simultaneously: they act as thermal barriers to prevent fire spread, provide structural support between components, and facilitate heat dissipation when combined with thermally conductive materials. This multi-functionality reduces the need for separate components, thereby limiting the increase in device complexity.

Inventive Principle:
Principle #6Universality (Multi-functionality)

Solution Approach 2:

The patent employs phase change materials in the thermal isolation plates that undergo phase transitions (e.g., from solid to liquid) when exposed to high temperatures. This parameter change allows the plates to absorb large amounts of heat during combustion events, providing passive fire protection without requiring complex active cooling systems.

Inventive Principle:
Principle #35Parameter changes

3Loss of energy

If thermally conductive plates are used to transmit heat outside, then heat dissipation is improved, but heat transmission to surrounding components increases

Engineering Contradiction:
Improveheat dissipationVSAvoidheat transmission to components
Core Design Contradiction:
Loss of energyVSObject-affected harmful factors

Solution Approach 1:

The patent implements a differentiated thermal management strategy where different regions of the battery pack have different thermal properties. Thermal isolation plates with high thermal conductivity are placed in regions dedicated to heat dissipation (facing outward), while thermal isolation plates with low thermal conductivity are positioned between adjacent cells and components to prevent harmful heat transmission. This local quality differentiation allows simultaneous heat dissipation and fire prevention.

Inventive Principle:
Principle #3Local quality

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution effectively controls heat transmission between the cell assembly and circuit board, slowing down the spread of combustion or explosions, thereby improving fire prevention and thermal isolation while maintaining heat dissipation functionality.

Implementation Method 1

one or more first thermal isolation plate, disposed between the cell assembly and the circuit board, and used for reducing the transmission of heat between the cell assembly and the circuit board

Methodology Applied
Scientific EffectThermal insulation: Thermal Insulation

Implementation Method 2

one or more thermally conductive plate, configured to at least partially transmit heat generated by the cell assembly in the internal space to the outside

Methodology Applied
Scientific EffectHeat conduction: Conduction (thermal)

Data Source

PatentEP4471931A1Battery pack and battery pack heat management apparatus
Publication Date: 2024.12.04 TECHTRONIC CORDLESS GP
  • EP4471931A1 patent drawingFigure 1
  • EP4471931A1 patent drawingFigure 2
  • EP4471931A1 patent drawingFigure 3

AI summary

Battery pack (100) for supplying power to an electric tool comprising a housing (110), defining an internal space of the battery pack; a cell assembly (140), located in the internal space and comprising multiple cells; a circuit board (151), located in the internal space and disposed at one side of the cell assembly (140), a heat management apparatus comprising a thermal isolation plate (170), disposed between the cell assembly (140) and the circuit board (151), and used for reducing the transmission of heat between the cell assembly and the circuit board; and a thermally conductive plate (180), configured to at least partially transmit heat generated by the cell assembly (140) in the internal space to the outside. This ensures heat dissipation functionality while maintaining thermal isolation of the circuit board.