Battery Connection Module With Single-Layer Crossed Trace Layout

The patent applies dimensionality change by making the circuit board flexible and enabling it to fold along a folding line. This transforms a two-dimensional planar layout into a three-dimensional folded structure, allowing wiring intersections to be achieved in limited space while maintaining a single layer construction. The flexible circuit board can be folded such that wiring lines intersect at different spatial levels, resolving the contradiction between cost reduction and wiring complexity.

The patent applies segmentation by dividing the flexible circuit board into multiple sections separated by folding lines. Instead of cutting through the board to create intersections, the board is segmented into regions that can be folded independently. This allows wiring lines to intersect in three-dimensional space while maintaining the continuous structural integrity of each segment, avoiding the strength reduction associated with cutting.

The patent uses dimensionality change to achieve wiring intersections in a single layer by folding the circuit board in three-dimensional space. This eliminates the need for multiple layers, thereby significantly reducing manufacturing costs while still achieving the required wiring intersections. The folding mechanism creates vertical separation between wiring lines that would otherwise require multiple planar layers.