Battery Outer Laminate Structure for Low-Temperature Heat Sealing
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Solution Overview
Problem
Conventional metal exterior materials for electrical storage devices face challenges in shape diversification and weight reduction, and heat-sealing at high temperatures leads to crushing and reduced insulation quality, while low-temperature sealing compromises sealability.
Innovation Solution
A laminate structure comprising a base material layer, barrier layer, and heat-sealable resin layer with specific melting peak temperatures and polyolefin backbones, allowing heat-sealing at 120°C and maintaining integrity at 100°C environments.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If heat-sealing is performed at high temperature (about 200°C), then heat-sealing strength is improved, but the heat-sealed part is crushed and thickness is reduced
Solution Approach 1:
The invention changes the temperature parameter from conventional high temperature (200°C) to low temperature (120°C or lower) heat-sealing. This parameter change allows achieving sufficient heat-sealing strength while preventing crushing and thickness reduction of the heat-sealed part, thereby resolving the technical contradiction between heat-sealing strength and manufacturing precision.
2Manufacturing precision
If heat-sealing is performed at low temperature, then crushing of heat-sealed part is suppressed, but heat-sealing strength is reduced
Solution Approach 1:
The invention uses a composite laminate structure comprising a base material layer, barrier layer, adhesive layer, and heat-sealable resin layer. The heat-sealable resin layer contains specific polymers (polyethylene, polypropylene, or their copolymers) with controlled melting points. This composite structure enables low-temperature heat-sealing (120°C or lower) while maintaining adequate sealability, resolving the contradiction between manufacturing precision and heat-sealing strength.
3Strength
If metal exterior materials are used, then strength and heat resistance are improved, but shape diversification and weight reduction are limited
Solution Approach 1:
The invention replaces rigid metal exterior materials with a flexible laminate film structure consisting of multiple layers including base material layer, barrier layer, adhesive layer, and heat-sealable resin layer. This flexible film structure enables easy shape diversification and thickness reduction while maintaining adequate strength and heat resistance through the composite layer design, thereby resolving the contradiction between strength and adaptability.
4Strength
If metal exterior materials are used, then strength is improved, but weight reduction is limited
Solution Approach 1:
The invention substitutes heavy metal exterior materials with a lightweight laminate film structure comprising base material layer, barrier layer, adhesive layer, and heat-sealable resin layer. The total thickness can be controlled (e.g., 50 μm or more) while maintaining adequate strength through the composite structure, achieving significant weight reduction compared to metal materials, thus resolving the contradiction between strength and weight.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The laminate structure ensures robust sealability and insulation even at lower heat-sealing temperatures, preventing unsealing under elevated conditions.
Implementation Method 1
the heat-sealable resin layer has a melting peak temperature observed at 130° C. or lower
Implementation Method 2
the adhesive layer has a melting peak temperature observed at 135° C. or higher
Data Source
AI summary
An outer packaging for electrical storage devices is composed of a laminate provided with at least a substrate layer, a barrier layer, an adhesive layer, and a thermally adhesive resin layer in this order, wherein the peak melting temperature for the thermally adhesive resin layer is observed at 130° C. or lower, the peak melting temperature for the adhesive layer is observed at 135° C. or higher, the resin constituting the thermally adhesive resin layer has a polyolefin skeleton, and the resin constituting the adhesive layer has a polyolefin skeleton.