Battery Pack PCB Encapsulation Using Adhesion Holes
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing battery packs face issues with moisture and debris entering through slots, causing short circuits and damage to electronic components on the printed circuit board due to inadequate adhesion of low-pressure molded material to exposed edges and flat surfaces.
Innovation Solution
The use of adhesion holes with diameters ranging from 0.5 mm to 2 mm, positioned around components on the printed circuit board, allows low-pressure molded material to flow through and adhere better, preventing moisture and debris infiltration.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If low pressure molded material is applied to encapsulate the printed circuit board, then protection from moisture and debris is improved, but adhesion to exposed edges and flat surfaces is insufficient
Solution Approach 1:
The patent introduces an array of holes (porous structure) in the printed circuit board to enable the low pressure molded material to flow through and create mechanical interlocking. This porous approach transforms the flat, non-adhering surface into a structure that positively engages the encapsulant material, solving the adhesion problem while maintaining protection.
Solution Approach 2:
The patent transitions from a two-dimensional flat surface problem to a three-dimensional solution by creating holes through the PCB. This allows the encapsulant to flow through the board thickness, creating anchoring points on both sides and within the board structure, thereby achieving reliable adhesion that was impossible with surface-only application.
2Ease of operation
If slots are provided in the housing for electrical terminals, then electrical connection is enabled, but moisture and debris can enter the housing
Solution Approach 1:
The patent uses the low pressure molded encapsulant material as a flexible protective shell that conforms to the internal structures of the housing. This encapsulant acts as a barrier film that seals around the slots and electrical terminals, preventing moisture and debris ingress while allowing the electrical connections to function through the sealed interface.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enhances the adhesion of low-pressure molded material to the printed circuit board, effectively protecting encapsulated components from moisture and debris, thereby preventing damage and ensuring reliable operation.
Implementation Method 1
a low pressure molded material applied to the printed circuit board such that the plurality of components are exposed and surrounded by the low pressure molded material; and the low pressure molded material having flowed through the plurality of adhesion holes
Data Source
AI summary
The present disclosure is directed to a battery pack comprising a housing, a plurality of battery cells, a battery cell holder holding the plurality of battery cells, a printed circuit board, a plurality of components requiring exposure, the plurality of components affixed to the printed circuit board, a plurality of adhesion holes positioned to form a boundary about the plurality of components, a low pressure molded material applied to the printed circuit board such that the plurality of components are exposed and surrounded by the low pressure molded material.