Battery Pack Circuit Board Cooling With Insulated Heat Sink Coupling
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional battery packs face challenges in effectively dissipating heat generated by the circuit board, leading to potential overheating issues.
Innovation Solution
A battery pack design incorporating a housing assembly, cell assembly, first circuit board, first heat sink, and first structural member, where the first structural member is positioned between the circuit board and heat sink, and an insulator is used to enhance heat dissipation by bonding these components and allowing for improved thermal conductivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a heat sink is provided between cells for heat dissipation, then heat dissipation for cells is improved, but heat dissipation effect for the circuit board remains limited
Solution Approach 1:
The patent introduces a structural member as an intermediary component between the circuit board and heat sink. This structural member includes a heat dissipation component that directly contacts the circuit board, while an insulating component isolates it electrically from the heat sink. This mediator enables thermal coupling between the circuit board and heat sink while maintaining electrical isolation, thereby resolving the contradiction between improving heat dissipation and preventing circuit board overheating.
2Temperature
If the circuit board is directly connected to the heat sink for heat dissipation, then heat dissipation is improved, but electrical insulation is compromised
Solution Approach 1:
The structural member employs composite material design, combining a heat dissipation component (typically metallic with high thermal conductivity) and an insulating component (with high electrical resistance). This composite structure allows the heat dissipation component to efficiently conduct heat away from the circuit board while the insulating component prevents electrical current flow between the circuit board and heat sink, thus achieving both thermal efficiency and electrical safety.
3Object-affected harmful factors
If insulation material is added between the circuit board and heat sink, then electrical insulation is improved, but heat dissipation efficiency deteriorates
Solution Approach 1:
The insulation system is segmented into two distinct functional components: a heat dissipation component that maintains thermal contact with the circuit board for efficient heat transfer, and an insulating component that provides electrical isolation. This segmentation allows each component to optimize its specific function without compromising the other, enabling simultaneous achievement of good electrical insulation and heat dissipation efficiency.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design effectively improves heat dissipation from the circuit board and cell assembly, providing enhanced protection and cooling for the battery pack, especially when subjected to external impacts.
Implementation Method 1
the housing assembly, the cell assembly, the first circuit board, the first structural member, and the first heat sink are bonded by the first insulator
Implementation Method 2
with better thermal conductivity, the first insulator helps improve heat dissipation of the battery pack
Implementation Method 3
The first heat sink dissipates heat from the first circuit board and the cell assembly, along the first passage and then through the first through-hole and the second through-hole to the outside
Data Source
AI summary
A battery pack includes a housing assembly, a cell assembly, a first circuit board, a first heat sink, a first structural member, and a first insulator. The cell assembly includes a cell. The cell includes a cell housing, an electrode assembly, and an electrode terminal connected to the electrode assembly and led out from the cell housing. The first circuit board is disposed in the housing assembly and connected to the electrode terminal. The first heat sink is disposed in the housing assembly. The first structural member is disposed between the first circuit board and the first heat sink. An outer surface of the first structural member is provided with an insulating material. At least a part of the first insulator is disposed between the first structural member and the first heat sink, and the first structural member and the first heat sink are bonded by the first insulator.