Battery Pack PCB Welding Structure With Inner-Layer Protection
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Solution Overview
Problem
Existing printed circuit boards used in battery packs are prone to damage during welding, particularly the inner layers, leading to potential disconnection and insulation layer destruction.
Innovation Solution
A printed circuit board design featuring a solder resist layer on the copper foil layer with a gap adjacent to the welded portion, preventing direct contact between the metal tab and inner layer during welding.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If welding is performed to connect the metal tab on the printed circuit board, then electrical connection is achieved, but the inner layers of the printed circuit board may be damaged
Solution Approach 1:
The patent introduces a gap structure as an intermediary space between the metal tab and the inner layer of the printed circuit board. This gap acts as a protective mediator that prevents direct contact between the welding heat source and the inner layer, thereby protecting the inner layer from thermal damage while still allowing electrical connection through the copper foil layer and solder resist layer.
Solution Approach 2:
The patent segments the printed circuit board structure into distinct functional layers (inner layer, copper foil layer, solder resist layer) with a deliberate gap between the metal tab and inner layer. This segmentation allows the welding process to affect only the outer layers while isolating the inner layer from harmful thermal effects.
2Reliability
If the inner layer is damaged during welding, then welding connection is achieved, but disconnection and insulating layer destruction occur
Solution Approach 1:
The gap structure serves as a protective intermediary that prevents welding heat from reaching the inner layer and insulating layer. This mediator layer (the gap) allows the welding process to proceed successfully on the outer layers while protecting the inner structural integrity from thermal damage that would cause disconnection.
Solution Approach 2:
The patent employs beforehand cushioning by pre-establishing the gap structure before welding occurs. This pre-existing protective space cushions the inner layer against the thermal shock and mechanical stress of the welding process, preventing damage to the insulating layer and maintaining structural stability throughout the welding operation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Prevents damage to the inner layer of the printed circuit board during welding, maintaining structural integrity and reducing disconnection risks.
Implementation Method 1
a solder resist layer formed on an upper part of the first copper foil layer, wherein when welding a metal tab onto the solder resist layer, a welded portion that couples the metal tab and the first copper foil layer is formed, and a gap is formed at a portion adjacent to the welded portion
Data Source
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AI summary
A printed circuit board according to one embodiment of the present disclosure includes an inner layer; a first insulating layer formed on an upper part of the inner layer; a first copper foil layer formed on an upper part of the first insulating layer; and a solder resist layer formed on an upper part of the first copper foil layer, wherein when welding a metal tab onto the solder resist layer, a welding portion that couples the metal tab and the first copper foil layer is formed, and a gap is formed at a portion adjacent to the welding portion.