Battery Pack Switch Thermal Management via Segmentation
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Solution Overview
Problem
Existing battery packs face challenges in reducing size while maintaining effective heat dissipation from switches, as the heat dissipators are typically larger than the circuit board, leading to increased base size and inefficiencies.
Innovation Solution
The battery pack design incorporates housing switches with a higher average current flow, mounted in a housing with enhanced heat dissipation capacity, and board switches with lower current flow, positioned on a circuit board with lower heat dissipation capacity, allowing for a reduced overall size without compromising heat dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If all switches are mounted on the base with heat dissipators, then heat dissipation capacity is improved, but the base size increases
Solution Approach 1:
The patent divides switches into two categories: housing switches (first switches) mounted on the housing with heat dissipators for high current applications, and board switches (second switches) mounted on the circuit board for low current applications. This segmentation allows heat dissipation resources to be concentrated where most needed while reducing overall base size.
Solution Approach 2:
The patent applies different mounting locations and heat dissipation configurations to different switches based on their current requirements. High current switches receive dedicated heat dissipators on the housing, while low current switches use the circuit board mounting, creating localized quality differences that optimize both heat dissipation and space utilization.
2Temperature
If heat dissipators are made larger to improve heat dissipation, then heat dissipation capacity is improved, but device complexity increases
Solution Approach 1:
The patent segments the switch population into two groups based on current requirements, allowing simplified heat dissipation structures to be used for low current switches while dedicating enhanced heat dissipation to high current switches. This reduces overall structural complexity compared to providing large heat dissipators for all switches.
Solution Approach 2:
The patent applies full heat dissipation capability only to the extent necessary for each switch's current requirements. Low current switches receive minimal heat dissipation support through circuit board mounting, while high current switches receive enhanced heat dissipation through housing mounting with heat dissipators, avoiding excessive heat dissipation structures throughout the entire system.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design effectively reduces the size of the battery pack while ensuring adequate heat dissipation from switches, optimizing space utilization and thermal management.
Implementation Method 1
The housing (71) has a higher capacity of heat dissipation than the circuit board (20)
Implementation Method 2
The first switches (31, 32) are disposed in the housing (71)... ensuring a required capacity to dissipate heat from switches
Data Source
AI summary
A battery pack is provided which includes a battery, a circuit board equipped with load feed lines, bus bars connecting with the battery and the circuit board, first and second switches, and third to sixth switches. The first and second switches are disposed in a housing which is higher in capacity of heat dissipation than the circuit board. The third to sixth switches are disposed on the circuit board. The first and second switches are larger in amount of electrical current flowing therethrough than the third to sixth switches on time average. This enables the size of the battery pack to be reduced without sacrificing the dissipation of heat from the switches.