Power Storage Packaging Film Structure for Stable Corner Moldability
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Solution Overview
Problem
Conventional packaging materials for power storage devices face issues with inconsistent moldability due to lubricant transfer and delamination, especially at angled corners, and fail to provide stable slipperiness across the entire surface.
Innovation Solution
A packaging material comprising a metal foil layer, a substrate layer, an adhesive layer, and a heat-fusible layer with a seal layer portion containing both micro and coarse particles, which enhances slipperiness and prevents delamination by reducing contact area with molding jigs and increasing adhesiveness.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a lubricant is added to the exposed surface of the heat-fusible layer to enhance slipperiness, then moldability is improved, but the lubricant transfers during use causing variations in slipperiness and inconsistent moldability
Solution Approach 1:
The patent extracts the lubricant function from the heat-fusible layer surface by introducing a separate lubricant layer. This separate layer prevents lubricant transfer to the metal foil while maintaining slipperiness, resolving the contradiction between improved moldability and consistent performance.
Solution Approach 2:
The patent introduces an intermediate adhesive layer between the metal foil layer and heat-fusible layer that acts as a barrier to prevent lubricant transfer. This intermediary layer maintains the stability of the metal foil layer while allowing the heat-fusible layer to provide consistent slipperiness.
2Volume of moving object
If molding portions are formed at angles close to right angles in corners, then housing space is secured, but delamination occurs making it difficult to achieve good moldability
Solution Approach 1:
The patent applies preliminary action by pre-forming recesses in the metal foil layer at corner portions before final molding. This preliminary structural preparation prevents delamination during high-angle molding while maintaining the required housing space volume.
Solution Approach 2:
The patent applies local quality by creating recesses specifically at corner portions where high-angle molding occurs, rather than uniformly across the entire structure. This localized modification prevents delamination at critical stress points while preserving overall housing space.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The material achieves stable and improved moldability by reducing delamination and ensuring consistent slipperiness, even at angled corners, while maintaining operational reliability of the power storage device.
Implementation Method 1
an adhesive layer provided on an inner surface side of the metal foil layer; and a heat-fusible layer made of heat-fusible resin, the heat-fusible layer being provided on an inner surface side of the adhesive layer
Implementation Method 2
the seal layer portion is configured by a layer containing the micro particles and the coarse particles... which enhances slipperiness and prevents delamination by reducing contact area with molding jigs
Data Source
AI summary
A packaging material for a power storage device includes a metal foil layer, a resin substrate layer, an adhesive layer, and a heat-fusible layer. The heat-fusible layer includes a metal foil side layer portion and a seal layer portion arranged on an innermost surface. When particles with an average particle size of 0.05 μm or more and less than 5 μm are defined as “micro particles,” and particles with an average particle size of 5 μm or more and 20 μm or less are defined as “coarse particles,” the seal layer portion is configured by a layer containing the micro particles and the coarse particles. The metal foil side layer portion is configured by a layer that contains the micro particles and does not contain particles with an actual particle size of 5 μm or more.