Battery Module Conductive Pad Structure for Short-Circuit Isolation

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Solution Overview

Problem

Existing battery module designs face challenges in reliable automatic assembly due to the risk of short circuits and damage to flexible interconnects caused by sharp edges and burrs on busbars, leading to reduced reliability and increased costs.

Innovation Solution

A non-flat conductive pad with a U-shape or similar configuration is used between the flexible interconnect and the busbar, creating a spaced connection that reduces the risk of short circuits and enhances mechanical flexibility, allowing for improved automatic assembly and reliability.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of manufacture

If a flat conductive pad is used to connect the flexible interconnect to the busbar, then the assembly process is simple, but the risk of short circuits increases due to sharp edges and burrs on the busbar contacting the flexible interconnect

Engineering Contradiction:
Improveassembly simplicityVSAvoidshort circuit risk
Core Design Contradiction:
Ease of manufactureVSReliability

Solution Approach 1:

The conductive pad is designed with a non-flat, three-dimensional structure featuring a first part in a first plane and a second part in a second plane spaced apart from the first plane. This dimensional transition creates a stepped configuration that elevates the flexible interconnect away from the busbar surface, preventing contact with sharp edges and burrs while maintaining electrical connection.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Solution Approach 2:

The conductive pad acts as an intermediary element between the busbar and the flexible interconnect. The first part of the pad contacts the busbar while the second part contacts the flexible interconnect, mediating the connection and providing a protective barrier that prevents direct contact between the flexible interconnect and potential harmful surface features on the busbar.

Inventive Principle:
Principle #24Intermediary (Mediator)

2Volume of moving object

If the flexible interconnect is placed close to the busbar for compact design, then the space utilization is improved, but the mechanical flexibility and stress absorption capability are reduced

Engineering Contradiction:
Improvespace utilizationVSAvoidmechanical flexibility
Core Design Contradiction:
Volume of moving objectVSAdaptability or versatility

Solution Approach 1:

The conductive pad utilizes a vertical dimension by extending from a first plane to a second plane spaced apart from the first plane. This three-dimensional configuration allows the flexible interconnect to be positioned at a different elevation relative to the busbar, creating mechanical clearance that enhances flexibility and stress absorption while maintaining compact horizontal footprint.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Solution Approach 2:

The conductive pad features an asymmetric stepped structure with a first part and a second part at different elevations, rather than a symmetric flat configuration. This asymmetric design provides both compactness and the necessary mechanical clearance for flexibility.

Inventive Principle:
Principle #4Asymmetry

3Reliability

If a non-flat conductive pad with spaced connection is used, then the reliability and mechanical flexibility are improved, but the manufacturing complexity increases

Engineering Contradiction:
Improveshort circuit preventionVSAvoidpad structure complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The conductive pad is segmented into distinct functional parts: a first part in a first plane for contacting the busbar, and a second part in a second plane for contacting the flexible interconnect. This segmentation allows each part to be optimized for its specific function while maintaining overall integration as a single conductive element.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The transition from a two-dimensional flat pad to a three-dimensional stepped pad adds manufacturing complexity. However, this dimensional change enables the pad to simultaneously achieve compactness, reliability through short circuit prevention, and mechanical flexibility through increased clearance.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Data Source

PatentUS20250158239A1Battery Module
Publication Date: 2025.05.15 SAMSUNG SDI CO LTD
  • US20250158239A1 patent drawing
  • US20250158239A1 patent drawing
  • US20250158239A1 patent drawing

AI summary

A battery module includes: a plurality of battery cells; a busbar electrically connecting the battery cells to each other; a flexible interconnect configured to provide electrical information of the battery cells to a battery management system; and a conductive pad between the flexible interconnect and the busbar. The conductive pad includes: a first part extending in a first plane; a second part extending in a second plane parallel to the first plane and spaced apart from the first part in a direction perpendicular to the first and second planes; and a third part connecting the first part and second part. The first part extends from the third part in a direction opposite the direction the second part extends from the third part. The busbar is attached to the first part of the conductive pad, and the flexible interconnect is attached to the second part of the conductive pad.