Battery Interconnect PCB With VIA Temperature Sensing

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Solution Overview

Problem

Existing battery modules face challenges in efficiently and reliably monitoring individual cell temperatures due to the complexity of wiring and soldering dedicated temperature sensors, which increases production costs, weight, and risks of electrical arcs, while current solutions often rely on limited sensor numbers that fail to detect thermal runaway conditions early.

Innovation Solution

An electrical interconnect board with integrated temperature measurement capabilities using a printed circuit board (PCB) that incorporates thermoelectric junctions (VIAs) between different conductive layers to measure cell temperatures, eliminating the need for wired or soldered sensors and enabling high-resolution temperature mapping.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Measurement precision

If dedicated temperature sensors are wired or soldered to each battery cell, then temperature measurement capability is improved, but device complexity and wiring effort increase significantly

Engineering Contradiction:
Improvetemperature measurement capabilityVSAvoidwiring effort and connection points
Core Design Contradiction:
Measurement precisionVSDevice complexity

Solution Approach 1:

The patent merges the temperature sensing function with the existing electrical interconnect board by integrating thermoelectric junctions into the PCB structure. Instead of adding separate wired sensors to each battery cell, the temperature measurement capability is combined with the electrical connection board, eliminating extensive wiring while enabling individual cell temperature monitoring through the VIAs that already exist in the PCB for electrical interconnection.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The electrical interconnect board is given multiple functions: it serves both as the electrical connection matrix for interconnecting battery cells in series and parallel configurations, and as an integrated temperature measurement system. The same PCB structure and VIAs used for electrical connectivity are utilized for thermal sensing, making the system multi-functional and avoiding additional complexity.

Inventive Principle:
Principle #6Universality (Multi-functionality)

2Measurement precision

If individual battery cell temperature monitoring is implemented with multiple sensors, then measurement precision is improved, but manufacturing cost increases due to additional production steps

Engineering Contradiction:
Improveindividual cell temperature monitoringVSAvoidproduction cost and manufacturing steps
Core Design Contradiction:
Measurement precisionVSEase of manufacture

Solution Approach 1:

The manufacturing process integrates temperature sensing capabilities into the standard PCB fabrication process. The thermoelectric junctions are created using the same layer structure and VIA formation processes already required for electrical interconnection, eliminating the need for separate sensor procurement and assembly steps. This merging of functions reduces manufacturing complexity and cost while enabling individual cell temperature monitoring.

Inventive Principle:
Principle #5Merging (Combining)

3Measurement precision

If wired temperature sensors are distributed across the battery system, then temperature measurement coverage is improved, but reliability decreases due to arc tracing problems and insulation coordination issues

Engineering Contradiction:
Improvetemperature measurement coverageVSAvoidarc tracing and insulation coordination
Core Design Contradiction:
Measurement precisionVSReliability

Solution Approach 1:

The patent eliminates the harmful separation between electrical connection and temperature sensing by merging both functions into a single integrated PCB system. The thermoelectric junctions are formed within the insulated PCB structure using the same VIA pathways used for electrical connection, ensuring proper insulation coordination and eliminating arc tracing problems associated with distributed wired sensors. The integrated design maintains reliability while achieving comprehensive temperature coverage.

Inventive Principle:
Principle #5Merging (Combining)

4Measurement precision

If dedicated temperature sensors are procured and installed for each battery cell, then measurement precision is improved, but weight increases which is critical for aircraft applications

Engineering Contradiction:
Improveindividual cell temperature monitoringVSAvoidsystem weight
Core Design Contradiction:
Measurement precisionVSWeight of moving object

Solution Approach 1:

The patent eliminates the need for separate dedicated temperature sensors by merging the sensing function into the electrical interconnect board. The thermoelectric junctions are formed using the same PCB materials and structures already present in the system, removing the weight of additional sensor components, wiring, and mounting hardware. This integration achieves individual cell temperature monitoring while minimizing weight increase, which is critical for aircraft applications.

Inventive Principle:
Principle #5Merging (Combining)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution allows for cost-effective, lightweight, and reliable individual battery cell temperature monitoring, reducing the risk of thermal runaway by detecting temperature anomalies early and avoiding the drawbacks of traditional sensor implementations.

Implementation Method 1

The first electrically conductive layer and the second electrically conductive layer are made from different electrically conductive materials. The first electrically conductive layer and the second electrically conductive layer are connected with each other through the insulating layer at a plurality of locations by a plurality of vertical interconnect accesses (VIAs). Each VIA builds a thermoelectric interface and thereby forms an integrated thermal sensor element that generates a voltage depending on the temperature at the thermoelectric interface.

Methodology Applied
Scientific EffectThermoelectric effect: Seebeck Effect

Data Source

PatentEP4451417B1Electrical interconnect board for a battery module with integrated temperature measurement capabilities
Publication Date: 2025.08.27 AIRBUS (SAS)
  • EP4451417B1 patent drawingFigure 1~2
  • EP4451417B1 patent drawingFigure 3~4
  • EP4451417B1 patent drawingFigure 5

AI summary

An electrical interconnect board (10) with integrated cell temperature measurement for a battery module (20) having a plurality of battery cells (21) and a battery module (20) comprising such an electrical interconnect board (10) is provided. The electrical interconnect board (10) comprises a printed circuit board (11) and a readout device (19). The printed circuit board (11) comprises an insulating layer (12), a first electrically conductive layer (13), and a second electrically conductive layer (14). The first electrically conductive layer (13) and the second electrically conductive layer (14) are arranged on opposite sides of the insulating layer (12). The printed circuit board (11) comprises a plurality of receptacles (16) each configured for accommodating a corresponding battery cell (21) of the battery module (20). The first electrically conductive layer (10) is configured to electrically interconnect the plurality of battery cells (21) with each other. The first electrically conductive layer (13) and the second electrically conductive layer (14) are made from different electrically conductive materials. The first electrically conductive layer (13) and the second electrically conductive layer (14) are connected with each other through the insulating layer (12) at a plurality of locations by a plurality of vertical interconnect accesses (18), VIAs (18). Each VIA (18) builds a thermoelectric interface and thereby forms an integrated thermal sensor element that generates a voltage depending on the temperature at the thermoelectric interface. The readout device (19) senses the generated voltages of the VIAs (18) and determines corresponding temperature values.