Battery Protection Circuit Package Module Integration

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Solution Overview

Problem

Conventional battery protection circuits are bulky and require additional processes for mounting on battery packs, making them difficult to miniaturize and integrate effectively.

Innovation Solution

A package module for a battery protection circuit featuring a lead frame structure with internal and external connection terminals, a protection IC, dual FET chip, and passive devices, allowing for compact integration and easy mounting on battery packs using a substrate like a PCB, ceramic, or plastic.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If conventional protection circuit components (protection IC, two FETs, resistor, capacitor) are soldered to a PCB substrate, then the circuit functionality is achieved, but the overall size becomes excessively large

Engineering Contradiction:
Improveprotection circuit functionalityVSAvoidcircuit board area
Core Design Contradiction:
ReliabilityVSArea of stationary object

Solution Approach 1:

The patent combines multiple discrete protection circuit components (protection IC, two FETs, resistor, capacitor) into a single integrated package module. The lead frame structure integrates all these components and their interconnections into one unified unit that can be mounted as a single component, dramatically reducing the overall space required while maintaining full protection circuit functionality.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The patent employs a nested structure where the protection IC and dual FET chip are mounted on a lead frame substrate, with passive devices integrated around them. The entire assembly is then encapsulated within a protective package housing, creating a compact nested arrangement that minimizes external dimensions while preserving all internal component functions.

Inventive Principle:
Principle #7Nested doll (Nesting)

2Reliability

If the protection circuit is mounted on a battery pack using conventional PCB mounting, then the circuit is protected, but additional mounting processes and wiring steps are required

Engineering Contradiction:
Improvecircuit protectionVSAvoidmounting process complexity
Core Design Contradiction:
ReliabilityVSEase of manufacture

Solution Approach 1:

The patent performs preliminary integration of all protection circuit components, interconnections, and packaging into a single pre-assembled module before delivery to the battery pack manufacturer. The lead frame structure is pre-formed with all electrical connections established, and the entire assembly is pre-encapsulated, eliminating the need for complex on-site mounting and wiring operations.

Inventive Principle:
Principle #10Preliminary action

Solution Approach 2:

The package module is designed with self-contained features including integrated lead frames that serve as both structural support and electrical interconnects, and built-in encapsulation that provides environmental protection without requiring additional sealing steps. The module mounts directly to the battery pack as a complete unit, with all connections and protections already in place.

Inventive Principle:
Principle #25Self-service

Data Source

PatentUS9450428B2Package module of battery protection circuit
Publication Date: 2016.09.20 ITM SEMICON CO LTD
  • US9450428B2 patent drawing
  • US9450428B2 patent drawing
  • US9450428B2 patent drawing

AI summary

Disclosed is a package module of a battery protection circuit. The package module comprises: a first internal connection terminal area and a second internal connection terminal area, and in which first and second internal connection terminals connected to a battery can provided with a bare cell are respectively disposed; an external connection terminal area, in which a plurality of external connection terminals are disposed; and a protection circuit area comprising a device area in which a plurality of passive devices forming the battery protection circuit are disposed and a chip area, which is adjacent to the device area, and in which a protection IC and a dual FET chip forming the battery protection circuit are disposed, are disposed between the external connection terminal area and the second internal connection terminal area.