L-Shaped Battery Recesses for 3D Component Nesting
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Solution Overview
Problem
Portable electronic devices face challenges in integrating advanced features such as structural rigidity, thermal mitigation, and efficient heat dissipation while maintaining a slim profile and accommodating multiple components like dual cameras and batteries in a compact design.
Innovation Solution
The electronic device incorporates a circuit board assembly with stacked layers connected by solder joints and stiffeners for structural support and thermal management, along with an L-shaped battery assembly that accommodates other components and provides a slim profile through notched designs for efficient component nesting.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If multiple components (dual cameras, batteries) are integrated into the device, then device functionality and features are improved, but device complexity and space requirements increase
Solution Approach 1:
The patent implements nesting by placing the display assembly within a recess of the battery assembly, and positioning the circuit board assembly within a recess of the battery assembly. This nested arrangement allows multiple components to occupy overlapping spatial volumes, reducing overall device complexity while maintaining advanced features like dual cameras and multiple batteries
Solution Approach 2:
The patent utilizes three-dimensional spatial arrangement by creating recesses in the battery assembly that extend in the thickness direction. Components are positioned at different vertical levels and horizontal positions, transforming a two-dimensional layout problem into a three-dimensional space utilization solution, enabling dual cameras and multiple batteries to coexist in a compact form factor
2Length of stationary object
If a slim profile is maintained, then device portability is improved, but space for heat dissipation and structural support is reduced
Solution Approach 1:
The patent applies local quality by positioning specific components (circuit board assembly, battery assembly) at optimized locations within recesses to create thermal pathways. The circuit board assembly is placed adjacent to the battery assembly in a configuration that facilitates heat transfer from high-heat-generating components to the battery assembly which acts as a heat sink, enabling effective heat dissipation within the slim profile
Solution Approach 2:
The patent uses the battery assembly as a thermal intermediary that receives heat from the circuit board assembly and dissipates it. The battery assembly serves dual purposes: power storage and thermal management, acting as a mediator that transfers and distributes heat away from sensitive components while maintaining the slim device thickness
3Length of stationary object
If a slim profile is maintained, then device portability is improved, but structural rigidity is reduced
Solution Approach 1:
The patent merges the structural functions of multiple assemblies by integrating the circuit board assembly and battery assembly within the same housing structure. The housing serves as a common structural framework that provides rigidity to the entire device while accommodating both assemblies in recesses, eliminating the need for separate structural supports and maintaining slim profile
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances structural rigidity, thermal dissipation, and component integration, enabling a compact and efficient design that supports advanced features like dual cameras and multiple batteries while maintaining a slim profile.
Implementation Method 1
stacked layers of circuit components that are retained in a stacked configuration and operably connected to each other by retention features such as solder joints
Implementation Method 2
different arrangements for conductive pathways that facilitate targeted dissipation of heat across the assembly
Data Source
AI summary
Electronic devices, such as mobile communication devices, may include several enhancements and modification not found on traditional electronic devices. An electronic device can include a circuit board assembly that includes stacked layers of circuit components that are retained in a stacked configuration and operably connected to each other by retention features such as solder joints. Features can be provided for structural support and thermal mitigation. A battery assembly can accommodate nesting of other components, such as display components, within one or more recesses defined by variable thickness along different regions of the battery assemblies. The battery assembly can further provide a slim profile by including notches to accommodate the increased thickness of a pouch having folded flaps to seal a cell module of the battery assembly.