Battery Shell Insert Molding with Metal Implanting Component
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Solution Overview
Problem
The traditional insert molding process for bonding a plastic component to a metal substrate in battery shells often results in poor bonding due to material differences and insufficient bonding area, leading to inadequate strength.
Innovation Solution
A method involving a metal implanting component with a bonding part, such as a through hole, hook, or groove, is bonded to a metal substrate and covered with a plastic component formed through insert molding, enhancing the bonding strength by ensuring secure fixation even with small bonding areas.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If a rough structure is formed on the metal substrate surface to increase bonding strength, then bonding effect is improved, but bonding area becomes insufficient when the substrate is small
Solution Approach 1:
The invention transitions from a 2D surface bonding approach to a 3D volumetric bonding approach by introducing a metal implanting component with through-holes. The plastic component bonds to the inner walls of these through-holes, creating bonding surfaces in multiple dimensions and significantly increasing the effective bonding area without increasing the footprint on the metal substrate surface.
Solution Approach 2:
The metal implanting component is designed with through-holes creating a porous structure. This porous configuration allows the plastic component to bond to the inner surfaces of the holes, dramatically increasing the bonding interface area. The porous structure enables effective bonding even when the overall component size is small, directly addressing the contradiction between limited bonding area and required bonding strength.
2Adaptability or versatility
If different materials (metal and plastic) are used for substrate and component, then functional requirements are met, but bonding effect deteriorates
Solution Approach 1:
The metal implanting component serves as an intermediary between the metal substrate and the plastic component. It provides a structure with through-holes that enables the plastic to bond mechanically, bridging the bonding gap between dissimilar materials. The intermediary structure facilitates strong bonding despite the inherent difficulties of bonding different materials directly.
Solution Approach 2:
The invention creates a composite structure consisting of metal substrate, metal implanting component with through-holes, and plastic component. This multi-material composite approach leverages the advantages of each material while overcoming their bonding incompatibilities. The composite structure achieves strong bonding between dissimilar materials through the engineered through-hole architecture.
3Volume of moving object
If bonding area is reduced to meet compact design requirements, then device size is minimized, but bonding strength becomes insufficient
Solution Approach 1:
The invention compensates for reduced bonding area by exploiting the third dimension - the depth of the through-holes. While the footprint on the metal substrate remains small, the bonding interface is extended vertically into the through-holes, creating large bonding surfaces within a compact volume. This dimensional transition allows strong bonding in miniaturized components.
Solution Approach 2:
The porous through-hole structure enables high bonding strength within a small volume. The holes create extensive internal bonding surfaces that would be impossible to achieve with flat surface bonding at the same footprint. This porous architecture allows the component to maintain compact dimensions while achieving sufficient bonding strength through increased internal surface area.
Data Source
AI summary
The disclosure discloses a method for manufacturing a battery shell applicable to an electronic device. The method includes providing a metal substrate, a metal implanting component including a connecting part disposed thereon; bonding the metal implanting component to the metal substrate; and forming a plastic component on the metal substrate by an insert molding process. The plastic component covers the metal implanting component. By bonding the plastic component to the bonding part of the metal implanting component, the bonding strength is enforced.