Battery Pack Substrate with Integrated Temperature Protection
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Solution Overview
Problem
Existing battery packs face challenges in achieving enhanced stability and miniaturization to meet the evolving requirements of portable electronic devices, particularly in preventing overheating and ensuring efficient electrical connections while maintaining compactness.
Innovation Solution
A battery pack design incorporating a substrate with integrated temperature protection devices, heat absorption plates, and a protection circuit module, featuring metal contacts and bent taps for secure electrical connections, along with a compact printed circuit board layout that includes heat radiation holes to manage heat dissipation and prevent overheating.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Power
If multiple unit cells are connected in parallel or series to increase output and capacity, then the battery pack can meet larger power requirements, but the device size and complexity increase
Solution Approach 1:
The patent integrates the temperature protection device directly onto the substrate (PCB) using metal contacts that electrically connect to the unit cells. This merging of the protection device with the electrical connection substrate eliminates the need for separate protection components, thereby reducing overall battery pack volume while maintaining multiple unit cell connections for high power output
Solution Approach 2:
The substrate serves multiple functions: it provides electrical connections between unit cells through metal contacts, supports the temperature protection device, and acts as a mounting platform for the protection circuit module. This multi-functionality reduces the number of separate components needed, allowing the battery pack to achieve high power through multiple cells without proportionally increasing volume
2Reliability
If the substrate includes metal contacts for temperature protection devices, then temperature monitoring and protection are improved, but the substrate structure becomes more complex
Solution Approach 1:
The metal contacts are integrated directly into the substrate structure, combining the electrical connection function with the temperature sensing function. The substrate itself becomes part of the temperature protection system, eliminating the need for separate sensing structures and reducing overall device complexity while improving temperature monitoring reliability
3Temperature
If heat radiation holes are added to the substrate, then heat dissipation and overheating prevention are improved, but the substrate integrity and electrical connections may be affected
Solution Approach 1:
Heat radiation holes are strategically positioned at specific locations on the substrate where they provide effective heat dissipation pathways without interfering with metal contacts or electrical connections. The substrate is designed with localized hole placements that maintain structural integrity in critical areas while enabling thermal management in appropriate regions
Solution Approach 2:
The substrate acts as an intermediary structure that balances thermal management needs with electrical connection requirements. By carefully designing the location and size of heat radiation holes, the substrate mediates between the need for heat dissipation and the need to maintain structural and electrical integrity, allowing both functions to coexist
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enhances the stability and compactness of battery packs by effectively preventing overheating and short circuits, ensuring reliable operation and increased space efficiency in host devices.
Implementation Method 1
a heat absorption plate between the substrate and temperature protection device
Implementation Method 2
one or more heat radiation holes located adjacent the temperature protection device
Data Source
AI summary
A battery pack includes a plurality of unit cells, a substrate electrically connected to the unit cells, a temperature protection device on the substrate, and a protection circuit module electrically connected to the substrate. The temperature protection device includes at least one metal contact electrically connected to the substrate. The substrate includes at least one hole at a location corresponding to the at least one metal contact. A width of the substrate is substantially equal to or less than widths of surfaces of the unit cells overlapping the substrate.