Battery Switch Heat Dissipation via Extraction and Intermediary

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Solution Overview

Problem

Existing battery devices face challenges in efficiently managing heat generated by power control elements, which can limit the performance and reliability of the switch due to thermal constraints on the circuit substrate.

Innovation Solution

Incorporating a heat radiator made of thermally conductive material, in direct or indirect contact with the exterior part of the switch through a heat conductor, to effectively dissipate heat away from the circuit substrate, thereby avoiding thermal bottlenecks and enhancing switch performance.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If the switch is mounted on the circuit substrate, then electrical connection is achieved, but heat accumulates on the circuit substrate limiting switch performance

Engineering Contradiction:
Improveswitch performanceVSAvoidcircuit substrate temperature
Core Design Contradiction:
ReliabilityVSTemperature

Solution Approach 1:

The exterior part of the switch is extracted from the circuit substrate and positioned away from it. The switch body remains electrically connected to the circuit substrate, but the heat-generating exterior part is separated and transferred to a dedicated heat radiator, thus removing the thermal constraint while maintaining electrical functionality.

Inventive Principle:
Principle #2Taking out (Extraction)

Solution Approach 2:

A heat conductor is introduced as an intermediary between the switch exterior part and the heat radiator. This heat conductor facilitates thermal transfer from the switch to the radiator while allowing the switch to remain positioned away from the circuit substrate, effectively mediating the thermal management function.

Inventive Principle:
Principle #24Intermediary (Mediator)

2Temperature

If the switch is positioned away from the circuit substrate, then heat dissipation is improved, but device complexity increases

Engineering Contradiction:
Improveswitch temperatureVSAvoidswitch mounting structure
Core Design Contradiction:
TemperatureVSDevice complexity

Solution Approach 1:

The heat radiator is merged with existing structural components of the battery device, such as the housing or mounting bracket. This integration allows the heat radiator to serve dual purposes: providing structural support and performing thermal management, thereby reducing overall device complexity despite the switch being positioned away from the circuit substrate.

Inventive Principle:
Principle #5Merging (Combining)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration allows for quick heat dissipation from the switch, reducing thermal influence on the circuit substrate and enabling high-output battery device performance without restrictions from the circuit substrate's heat-resistant temperature.

Implementation Method 1

a heat radiator made of a material having thermal conductivity and being in contact directly or indirectly through a heat conductor with the exterior part of the switch so that heat of the switch transfers to the heat radiator

Methodology Applied
Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentUS11695282B2Battery device
Publication Date: 2023.07.04 DENSO CORP
  • US11695282B2 patent drawing
  • US11695282B2 patent drawing
  • US11695282B2 patent drawing

AI summary

A battery device includes a battery pack, a circuit substrate which acquires battery information on the battery pack or controls charge and discharge of the battery pack, a switch including a first power element or a second power element, and a heat radiator. The switch is a device controlling input and output of electric power to and from the battery pack, and an exterior part of the switch is arranged away from the circuit substrate. The heat radiator is a member made of a material having thermal conductivity, and is in direct contact with or indirect contact via a heat conductor with the exterior part of the switch so that heat of the switch can be transferred.