Integrated Battery Temperature Board for Accurate Multi-Sensing

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Solution Overview

Problem

Conventional battery modules face challenges in simultaneously measuring voltage and temperature accurately due to separate structures for voltage/current and temperature sensing, leading to assembly issues and reduced temperature measurement accuracy.

Innovation Solution

A temperature measurement apparatus with a single integrated circuit board featuring a plating layer and temperature measurement pattern on opposite surfaces, allowing simultaneous measurement of voltage, current, and temperature, and including multiple temperature sensors for enhanced accuracy, and a fixing rib for secure connection to the battery management system.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of manufacture

If separate structures are used for voltage/current and temperature sensing, then assembly is simplified, but temperature measurement accuracy is reduced

Engineering Contradiction:
Improveassembly simplicityVSAvoidtemperature measurement accuracy
Core Design Contradiction:
Ease of manufactureVSMeasurement precision

Solution Approach 1:

The patent combines voltage/current sensing and temperature sensing into a single integrated circuit board structure. The temperature sensor is mounted on the same board as the voltage sensor, with electrical connections made through conductive patterns on the board. This integration allows simultaneous measurement of voltage, current, and temperature without requiring separate assembly structures, thereby improving temperature measurement accuracy while maintaining assembly simplicity.

Inventive Principle:
Principle #5Merging (Combining)

2Measurement precision

If multiple temperature sensors are used, then temperature measurement accuracy is improved, but device complexity increases

Engineering Contradiction:
Improvetemperature measurement accuracyVSAvoidstructure complexity
Core Design Contradiction:
Measurement precisionVSDevice complexity

Solution Approach 1:

The integrated circuit board serves multiple functions: it acts as a mounting substrate for temperature sensors, provides electrical connections through conductive patterns, and enables simultaneous voltage and current measurement. By making the circuit board multi-functional, the patent can accommodate multiple temperature sensors without proportionally increasing overall device complexity, as the same board structure handles multiple sensing tasks.

Inventive Principle:
Principle #6Universality (Multi-functionality)

Solution Approach 2:

The patent utilizes the two-dimensional surface of the circuit board to accommodate multiple temperature sensors at different positions. Instead of stacking sensors vertically or adding complex three-dimensional structures, the solution places sensors in the planar dimension on the board surface, with electrical connections routed through conductive patterns. This dimensional approach allows multiple sensors without significantly increasing structural complexity.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

3Productivity

If a single integrated structure is used, then assembly is optimized and space is maximized, but manufacturing precision requirements increase

Engineering Contradiction:
Improveassembly optimizationVSAvoidintegration precision
Core Design Contradiction:
ProductivityVSManufacturing precision

Solution Approach 1:

The patent segments the sensing functions into distinct components (voltage sensor, temperature sensor, conductive patterns) that are separately manufactured and then integrated onto the circuit board. This segmentation allows each component to be manufactured with standard precision tolerances independently, reducing the overall manufacturing precision requirements compared to creating a fully monolithic integrated structure. The board acts as an intermediary that assembles these segmented components into a functional whole.

Inventive Principle:
Principle #1Segmentation

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This solution optimizes the assembly process and increases temperature measurement accuracy by integrating voltage, current, and temperature measurement into a single structure, eliminating assembly failures and maximizing space for multiple temperature sensors, thereby improving the overall performance of battery modules.

Implementation Method 1

a plating layer formed as a metal material on a surface of the temperature measurement board and electrically connected to the battery cell to allow a charging/discharging current of the battery cell to flow therethrough

Methodology Applied
Scientific EffectElectrical conduction: Conduction (electrical)

Implementation Method 2

a temperature sensor mounted on an integrated circuit board

Methodology Applied
Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 3

a temperature measurement pattern formed as a conductive pattern on another surface of the temperature measurement board and electrically connected to the temperature sensor provided on the temperature measurement board

Methodology Applied
Scientific EffectElectrical conduction: Conduction (electrical)

Data Source

PatentUS20250096341A1Apparatus for measuring battery temperature
Publication Date: 2025.03.20 SAMSUNG SDI CO LTD
  • US20250096341A1 patent drawing
  • US20250096341A1 patent drawing
  • US20250096341A1 patent drawing

AI summary

A temperature measurement apparatus for measuring a temperature of a battery cell includes a temperature measurement board including at least one temperature sensor, the temperature measurement board being on an integrated circuit board, a plating layer on a first surface of the temperature measurement board and electrically connected to the battery cell to allow a charging/discharging current of the battery cell to flow therethrough, the plating layer being a metal layer, and at least one temperature measurement pattern on a second surface of the temperature measurement board and electrically connected to the at least one temperature sensor, the second surface being opposite the first surface, and the at least one temperature measurement pattern being a conductive pattern.