Battery Temperature Sampling Assembly With Heat-Conducting Base
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Solution Overview
Problem
Temperature sensors detach from busbar components in batteries due to adhesive loss and denaturation under high temperatures, leading to decreased sampling accuracy and data loss.
Innovation Solution
A temperature sampling assembly with a sampling circuit board, temperature sensing chip, and heat conducting base, where the sampling part is fixedly adhered to the heat conducting base through a fixing adhesive, allowing for reliable connection and heat conduction, even under high temperatures.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If adhesive is used to fix temperature sensor to busbar component, then temperature sampling can be implemented, but adhesive loses and denatures under high temperatures causing sensor detachment
Solution Approach 1:
The invention divides the temperature sampling system into separate functional modules: the temperature sensing chip remains on the sampling circuit board, while the heat conducting base is separately attached to the busbar component. This segmentation eliminates the need for adhesive between the sensor and busbar, solving the high-temperature detachment problem.
Solution Approach 2:
The invention introduces a heat conducting base as an intermediary component between the busbar component and the temperature sensing chip. This mediator enables thermal coupling for accurate temperature sensing while allowing the sensor to remain firmly mounted on the circuit board without exposure to high temperatures that would degrade adhesive.
2Measurement precision
If temperature sensor is directly attached to busbar component, then temperature measurement is achieved, but sampling accuracy decreases due to adhesive loss
Solution Approach 1:
By separating the temperature sensing function from the heat exposure environment, the invention ensures that the sensing chip operates in a stable, low-temperature zone on the circuit board while the heat conducting base captures temperatures from the busbar component, thereby maintaining measurement accuracy without adhesive degradation.
Solution Approach 2:
The heat conducting base serves as a mediator that accurately transfers thermal information from the high-temperature busbar component to the low-temperature sensing chip, enabling precise temperature measurement while protecting the sensing components from thermal damage that would compromise data reliability.
3Ease of manufacture
If adhesive is used for fixing, then assembly is simplified, but service life is reduced due to adhesive denaturation
Solution Approach 1:
The invention simplifies the long-term reliability aspect by segmenting the system so that the temperature sensing chip and sampling circuit board remain as a stable, adhesive-free unit, while only the heat conducting base requires attachment to the busbar component. This segmentation ensures the core sensing assembly maintains its integrity throughout the product's service life.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The assembly maintains sampling accuracy and extends service life by preventing adhesive loss and detachment, enabling accurate temperature measurement of batteries.
Implementation Method 1
the heat conducting base can conduct heat of the to-be-sampled component to the sampling part and the temperature sensing chip
Data Source
AI summary
A temperature sampling assembly includes a sampling circuit board, a temperature sensing chip, and a heat conducting base. The sampling circuit board includes a sampling part. The temperature sensing chip is mounted at the sampling part and is electrically connected to the sampling circuit board. The heat conducting base includes a first side and a second side opposite each other in a thickness direction. The first side is fixedly adhered to the sampling part through a fixing adhesive. The second side is configured to be connected to a to-be-sampled component.