Battery Temperature Sampling Assembly for Heat-Stable Sensor Attachment
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Solution Overview
Problem
Temperature sensors attached to busbar components in batteries detach easily due to adhesive loss and denaturation under high temperatures, leading to decreased sampling accuracy and data loss.
Innovation Solution
A temperature sampling assembly with a modular design, where a temperature sensing chip is mounted on a sampling circuit board and fixed to a heat conducting base using a fixing adhesive, ensuring reliable adhesion through multiple sides, and optionally using an insulating adhesive for electrical insulation and protection.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If a temperature sensor is fixed to a busbar component through an adhesive, then the temperature sensor can be easily attached to facilitate battery temperature sampling, but the adhesive is easily lost and denatured under high temperatures, causing the temperature sensor to detach from the busbar component
Solution Approach 1:
The temperature sampling assembly is divided into separate modules: the temperature sensor mounted on a sampling circuit board, and the heat conducting base that contacts the busbar component. This segmentation allows each module to be optimized independently - the sensor module for easy mounting on the board, and the heat conducting base for reliable thermal contact with the busbar, eliminating the adhesive reliability issue.
Solution Approach 2:
The sampling circuit board serves as an intermediary between the temperature sensor and the heat conducting base. Instead of directly adhering the sensor to the busbar component with adhesive, the sensor is mounted on the circuit board which then interfaces with the heat conducting base, providing a stable intermediate connection that avoids adhesive denaturation.
2Ease of manufacture
If adhesive is used to fix the temperature sensor to the busbar component, then the sensor can be attached, but the adhesive loses effectiveness and denatures under high temperatures, leading to sensor detachment
Solution Approach 1:
The temperature sensor is extracted from direct contact with the high-temperature busbar component and mounted on the sampling circuit board instead. This removes the sensor and its adhesive connection from the high-temperature environment, preventing adhesive denaturation while maintaining easy fixation capabilities.
Solution Approach 2:
The patent uses a modular design where the sampling circuit board with mounted sensor can be easily replaced if needed. The circuit board serves as a disposable or replaceable intermediate component that protects the expensive temperature sensor from high-temperature damage, allowing simple replacement rather than complex adhesive repair.
3Ease of manufacture
If the temperature sensor detaches from the busbar component due to adhesive failure, then the sensor can no longer reliably measure temperature, but continuing to use the system results in sampling accuracy decrease or sampling data loss
Solution Approach 1:
The temperature sensor is preliminarily mounted and firmly fixed to the sampling circuit board during manufacturing, ensuring proper positioning and electrical connection before the assembly is deployed. This preliminary secure mounting prevents detachment during operation, maintaining temperature sampling accuracy throughout the product lifecycle.
Solution Approach 2:
The sampling circuit board with mounted sensor acts as a protective cushioning layer between the temperature sensor and the harsh high-temperature environment of the busbar component. This beforehand protection shields the sensor from thermal stress and mechanical detachment, ensuring continuous accurate temperature measurement without requiring frequent recalibration or replacement.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The assembly maintains sampling accuracy and extends service life by preventing adhesive loss and detachment under high temperatures, ensuring reliable temperature measurement and reducing the risk of data loss.
Implementation Method 1
the heat conducting base can conduct heat of the to-be-sampled component to the sampling part and the temperature sensing chip
Implementation Method 2
the sampling part is fixedly adhered to the first side of the heat conducting base through the fixing adhesive
Data Source
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AI summary
This application pertains to the field of batteries and provides a temperature sampling assembly (30), a battery (1), and an electric apparatus. The temperature sampling assembly (30) includes a sampling circuit board (31), a temperature sensing chip (32), and a heat conducting base (33). The sampling circuit board (31) includes a sampling part (311). The temperature sensing chip (32) is mounted at the sampling part (311) and is electrically connected to the sampling circuit board (31). The heat conducting base (33) includes a first side (331) and a second side (334) opposite each other in a thickness direction (y). The first side (331) is fixedly adhered to the sampling part (311) through a fixing adhesive (34). The second side (334) is configured to be connected to a to-be-sampled component. The temperature sampling assembly (30) can be assembled independently of the to-be-sampled component. At least one side of the sampling part (311) can be flexibly coated with the fixing adhesive (34), so that at least one side of the sampling part (311) can be reliably fixed to the heat conducting base (33) through sufficient fixing adhesive (34), thereby reducing the risk of excessive loss and denaturation of the fixing adhesive (34) under high temperatures, reducing the risk of the sampling part (311) and the temperature sensing chip (32) detaching from the heat conducting base (33), reducing the risk of sampling accuracy decrease or sampling data loss of the temperature sampling assembly (30), and prolonging the service life of the temperature sampling assembly (30).