Battery Pack Thermal Interface Layout for Heat Dissipation and Adhesion
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Solution Overview
Problem
Conventional power storage devices face challenges in ensuring large heat conduction areas and maintaining adhesiveness between the power storage stack and the lower case, leading to reduced heat conductivity and adhesiveness.
Innovation Solution
The power storage device employs first and second heat conduction members that are pressed and enlarged by the power storage stack and the lower case's pedestal portion, allowing air to escape, thereby increasing their area and ensuring good heat conductivity and adhesiveness.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a cooler is disposed outside the housing case and a heat conduction member is used to adhere the power storage stack to the lower case, then heat dissipation is improved, but air may be trapped between the power storage stack and the lower case reducing adhesiveness
Solution Approach 1:
The invention divides the heat conduction path into multiple segments by introducing a pedestal portion between the lower case and the power storage stack. This segmentation allows air to escape from the space between the heat conduction member and the lower case, preventing air entrapment while maintaining thermal contact. The pedestal creates a stepped structure that facilitates air evacuation during assembly.
Solution Approach 2:
The invention introduces a vertical dimension element (the pedestal portion rising from the bottom wall) to create a stepped structure. This dimensional change allows air to escape laterally from the assembly interface, solving the air entrapment problem that occurs in flat, two-dimensional adhesive interfaces.
2Temperature
If recesses are provided between cooling surfaces to accommodate heat conduction members, then thermal contact is improved, but the heat conduction member area is reduced lowering heat conductivity
Solution Approach 1:
Instead of creating recesses in the cooling surface to accommodate the heat conduction member (which reduces the heat conduction member's area), the invention inverts the approach by providing a pedestal portion that rises from the lower case. This allows the heat conduction member to maintain its full area while still achieving intimate thermal contact with the power storage stack.
3Loss of energy
If the heat conduction member area is increased to improve heat conductivity, then thermal management is improved, but the device complexity increases
Solution Approach 1:
The pedestal portion serves multiple functions simultaneously: it provides structural support for the power storage stack, creates an air escape path to improve adhesiveness, and enables the heat conduction member to maintain its full area for optimal heat conductivity. This multi-functionality avoids increasing device complexity while achieving multiple objectives.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration maintains high heat conductivity while improving the adhesiveness between the power storage stack and the lower case, enhancing the overall performance of the device.
Implementation Method 1
a first heat conduction member disposed between the first cell group and the bottom wall portion; and a second heat conduction member disposed between the second cell group and the bottom wall portion
Implementation Method 2
By pressing and enlarging the first heat conduction member and the second heat conduction member by the power storage stack and the bottom wall portion
Implementation Method 3
a cooler is positioned outside the housing case for enhanced heat dissipation
Data Source
AI summary
A power storage device includes: a power storage stack including a first cell group, a second cell group, and a middle plate; a lower case having a bottom wall portion; a first heat conduction member disposed between the first cell group and the bottom wall portion; and a second heat conduction member disposed between the second cell group and the bottom wall portion. The lower case includes a pedestal portion supporting the middle plate, and the first heat conduction member and the second heat conduction member are provided to contact the pedestal portion.