Distributed Battery Voltage and Temperature Acquisition Boards
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Solution Overview
Problem
Existing battery pack monitoring systems face challenges with centralized data acquisition circuits that are inflexible for expansion and costly, while distributed systems are high in cost and low in precision, making it difficult to accurately monitor battery voltage and temperature across multiple packs.
Innovation Solution
A distributed apparatus with separate acquisition boards for each battery pack, each equipped with a voltage and temperature acquisition module, opto-isolator module, and CAN bus communication, powered by the battery pack, to improve precision and reduce manufacturing costs, and featuring a concise circuit layout for easier installation and maintenance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If a centralized data acquisition circuit is used, then manufacturing cost is reduced, but measurement precision and reliability deteriorate when malfunction occurs
Solution Approach 1:
The patent divides the centralized data acquisition circuit into multiple independent acquisition boards, with each board responsible for monitoring one or more battery packs. This segmentation allows each board to operate independently, improving measurement precision and reliability while maintaining cost-effectiveness through shared resources.
2Device complexity
If a centralized data acquisition circuit is used, then device complexity is reduced, but adaptability deteriorates when expanding to match battery pack quantity
Solution Approach 1:
The patent implements a dynamic configuration where acquisition boards can be independently added or removed based on the number of battery packs. Each board is designed to handle specific battery packs, allowing the system to scale flexibly without requiring complete circuit board redesign, thus improving adaptability while maintaining manageable complexity.
3Measurement precision
If distributed acquisition circuits are used, then measurement precision and reliability are improved, but manufacturing cost increases
Solution Approach 1:
The patent merges the advantages of distributed acquisition with cost-effectiveness by designing acquisition boards that can be configured in different topologies. Multiple battery packs can share acquisition boards through switch matrices, reducing the total number of boards needed compared to fully distributed systems, thereby lowering manufacturing cost while maintaining the precision and reliability benefits of distributed architecture.
4Adaptability or versatility
If distributed acquisition circuits are used, then adaptability is improved for configurative expansion, but device complexity and cost increase
Solution Approach 1:
The patent designs universal acquisition boards that can monitor one or multiple battery packs depending on configuration. The boards incorporate switch matrices and configurable connections that allow them to adapt to different system sizes and configurations, providing expandability without proportionally increasing overall system complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enhances the precision and counter-interference capability of voltage and temperature data acquisition, reduces manufacturing costs, and simplifies maintenance by isolating high-voltage and low-voltage circuits, ensuring accurate and efficient monitoring of battery packs without affecting battery balance.
Implementation Method 1
an opto-isolator module or a coil isolator module, a CAN bus communication module
Data Source
AI summary
An apparatus for monitoring battery voltage and temperature includes a host controller and acquisition boards, and every acquisition board for the battery includes a voltage acquisition module, a temperature acquisition module, a host control chip MCU, A/D convertor module, an opto-isolator module, a CAN bus communication module and two external connection ports CN1, CN2. The input end of the AD transformation module is connected with the output end of the voltage acquisition module and the temperature acquisition module, and the output end of the A/D convertor module is connected with the opto-isolator module via a SPI bus, and the I/O port of the SPI bus module in the main control chip MCU is connected with the opto-couple isolation module, and the host control chip MCU is connected with the CAN bus communication module of the host controller via the CAN bus communication module, and the acquisition boards are connected via a socket piece in turn.