Battery Wiring Module Fuse Substrate Layout for Lower Cost

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Solution Overview

Problem

The manufacturing cost of wiring modules for high-voltage battery packs is increased due to the need for custom flexible circuit substrates with holes and recesses, as standard-size substrates are punched to form individual pieces, leading to inefficiency and higher costs.

Innovation Solution

A wiring module configuration that includes a bus bar connected to electrode terminals, an electric wire, and a circuit substrate with a conductive path featuring a busbar land, electric wire land, and a fuse portion, optimized by using electric wires to reduce the usage amount and shape of the circuit substrate, thereby lowering manufacturing costs.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If custom flexible circuit substrates with holes and recesses are used, then electrical connection reliability is improved, but manufacturing cost increases

Engineering Contradiction:
Improveelectrical connection reliabilityVSAvoidmanufacturing cost
Core Design Contradiction:
ReliabilityVSEase of manufacture

Solution Approach 1:

The circuit substrate is divided into multiple standard-size substrates that are punched from a larger standard substrate. Each smaller substrate contains specific connection elements (busbar lands, electric wire lands, fuse portions) that collectively form the complete electrical connection system. This segmentation allows efficient use of standard substrates while maintaining reliable electrical connections.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The circuit substrate is designed to perform multiple functions: providing electrical connections between busbars and electric wires, incorporating fuse portions for protection, and enabling flexible routing. By integrating these functions into a standardized substrate design, the system achieves reliable electrical connection without requiring custom-made complex substrates.

Inventive Principle:
Principle #6Universality (Multi-functionality)

2Adaptability or versatility

If standard-size substrates are punched to form individual pieces, then manufacturing flexibility is improved, but material waste increases

Engineering Contradiction:
Improvemanufacturing flexibilityVSAvoidmaterial waste
Core Design Contradiction:
Adaptability or versatilityVSLoss of substance

Solution Approach 1:

A large standard-size substrate is divided into multiple smaller individual substrates through punching. Each smaller substrate is optimized for specific connection requirements but is derived from an efficient layout of the original standard substrate, minimizing material waste while maintaining manufacturing flexibility.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

Multiple functional elements (busbar lands, electric wire lands, fuse portions) are combined on individual substrates in a way that maximizes the utilization of the standard substrate material. The arrangement allows multiple substrates to be cut from one standard substrate with minimal waste, achieving both flexibility and material efficiency.

Inventive Principle:
Principle #5Merging (Combining)

Data Source

PatentUS20240014501A1Wiring module
Publication Date: 2024.01.11 AUTONETWORKS TECH LTD
  • US20240014501A1 patent drawing
  • US20240014501A1 patent drawing
  • US20240014501A1 patent drawing

AI summary

A wiring module is a wiring module that is attached to a plurality of power storage elements, and includes: a busbar that is connected to electrode terminals of the plurality of power storage elements, an electric wire, and a circuit substrate that connects the busbar and one end of the electric wire, a conductive path is routed on the circuit substrate, and the conductive path includes: a busbar land connected to the busbar, an electric wire land connected to the electric wire, and a fuse portion provided between the busbar land and the electric wire land.