BAW Resonator Electrode with Embedded SiO2 for Frequency Stability

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Solution Overview

Problem

Film bulk acoustic wave resonators suffer from spurious acoustic waves due to transverse acoustic waves generated perpendicular to the main acoustic wave, degrading frequency response, and temperature variations affect operating frequency, necessitating improved temperature compensation.

Innovation Solution

Incorporating silicon dioxide or similar materials with a positive temperature coefficient within the electrodes of the resonator to mitigate spurious waves and temperature-induced frequency changes, with the material being patterned or unpatterned and positioned closer to the piezoelectric layer to enhance effectiveness.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Stability of the object's composition

If temperature compensating material is added to the electrode, then frequency stability over temperature is improved, but device complexity increases

Engineering Contradiction:
Improvefrequency stabilityVSAvoiddevice complexity
Core Design Contradiction:
Stability of the object's compositionVSDevice complexity

Solution Approach 1:

The temperature compensating material (silicon dioxide) is merged with the electrode structure by embedding it within the bottom electrode layer. This integration allows the electrode to simultaneously perform its electrical function and provide temperature compensation, reducing device complexity while maintaining frequency stability.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The bottom electrode is formed as a composite structure combining copper (for electrical conductivity) and silicon dioxide (for temperature compensation). This composite material approach enables dual functionality within a single layered structure, improving frequency stability without significantly increasing device complexity.

Inventive Principle:
Principle #40Composite materials

2Object-generated harmful factors

If silicon dioxide layer is embedded in the electrode, then spurious acoustic waves are reduced, but manufacturing precision requirements increase

Engineering Contradiction:
Improvespurious acoustic wavesVSAvoidmanufacturing precision
Core Design Contradiction:
Object-generated harmful factorsVSManufacturing precision

Solution Approach 1:

The silicon dioxide layer is positioned locally within the bottom electrode at the interface with the piezoelectric layer, where it most effectively suppresses spurious acoustic waves. The layer is not distributed throughout the entire device but concentrated at the critical location, reducing manufacturing precision requirements while maintaining effectiveness.

Inventive Principle:
Principle #3Local quality

Solution Approach 2:

The silicon dioxide layer acts as an intermediary between the copper electrode and the piezoelectric layer, mediating the mechanical stress and acoustic wave interactions. This intermediary position allows it to effectively suppress spurious waves generated at the piezoelectric-electrode interface without requiring precise positioning throughout the entire structure.

Inventive Principle:
Principle #24Intermediary (Mediator)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Reduces spurious acoustic waves and minimizes frequency variation with temperature, improving quality factor, electromechanical coupling coefficient, and reducing resonator size while maintaining or enhancing resonance frequency stability.

Implementation Method 1

the temperature compensating material has a positive temperature coefficient of frequency

Methodology Applied
Scientific EffectTemperature coefficient of frequency:

Implementation Method 2

a layer of piezoelectric material disposed between a top electrode and a bottom electrode

Methodology Applied
Scientific EffectPiezoelectric effect: Piezoelectric Effect

Data Source

PatentUS20260081577A1Embedded silicon dioxide in electrode to reduce temperature coefficient of frequency in bulk acoustic wave resonator
Publication Date: 2026.03.19 SKYWORKS GLOBAL PTE LTD
  • US20260081577A1 patent drawing
  • US20260081577A1 patent drawing
  • US20260081577A1 patent drawing

AI summary

Aspects and embodiments disclosed herein include a film bulk acoustic wave resonator comprising a layer of piezoelectric material disposed between a top electrode and a bottom electrode and a temperature compensating material disposed within one of the top electrode or bottom electrode.