BAW RF Filter Topologies Using Single-Crystal Thin Films

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Solution Overview

Problem

Current bulk acoustic wave resonators using polycrystalline piezoelectric thin films face degradation in quality at frequencies above 5 GHz due to thickness limitations, while single crystalline films maintain performance but are challenging to manufacture and transfer effectively.

Innovation Solution

The development of manufacturing processes and structures for high-quality bulk acoustic wave resonators using single crystalline or epitaxial piezoelectric thin films, employing techniques like thin film transfer and sacrificial layers to enhance the quality factor and electro-mechanical coupling for high-frequency applications.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of manufacture

If polycrystalline piezoelectric thin films are used in bulk acoustic wave resonators, then manufacturing is easier and cost is lower, but quality factor degrades at frequencies above 5 GHz due to thickness limitations

Engineering Contradiction:
Improvemanufacturing easeVSAvoidquality factor
Core Design Contradiction:
Ease of manufactureVSReliability

Solution Approach 1:

The patent transitions from polycrystalline to single-crystal piezoelectric thin films, fundamentally changing the material's crystal structure parameter. This enables the resonators to maintain high quality factor at frequencies above 5 GHz by eliminating grain boundary losses inherent in polycrystalline materials, while preserving manufacturing feasibility through advanced deposition techniques.

Inventive Principle:
Principle #35Parameter changes

2Reliability

If single crystalline piezoelectric thin films are used to maintain performance at high frequencies, then quality factor improves, but manufacturing complexity and transfer difficulty increase

Engineering Contradiction:
Improvequality factorVSAvoidmanufacturing complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The patent employs preliminary substrate preparation and epitaxial growth processes to create single-crystal piezoelectric thin films with predetermined crystal orientation and uniform thickness. This preliminary structuring enables high-quality factor resonators while simplifying subsequent manufacturing steps, as the critical crystal structure is established before device assembly.

Inventive Principle:
Principle #10Preliminary action

Solution Approach 2:

The patent introduces sacrificial layers and temporary bonding substrates as intermediaries during the fabrication process. These intermediary elements facilitate the complex transfer and integration of single-crystal thin films, allowing manufacturers to work with delicate single-crystal structures without direct handling, thereby reducing manufacturing complexity.

Inventive Principle:
Principle #24Intermediary (Mediator)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach enables the production of high-performance RF filters with improved quality factor and reduced manufacturing complexity, effectively addressing the limitations of polycrystalline films at high frequencies and enabling efficient RF filter performance for 5G applications.

Implementation Method 1

bulk acoustic wave resonators (BAWR) using crystalline piezoelectric thin films

Methodology Applied
Scientific EffectPiezoelectric effect: Piezoelectric Effect

Implementation Method 2

Bulk acoustic wave resonators (BAWR) using crystalline piezoelectric thin films are leading candidates for meeting such demands

Methodology Applied
Scientific EffectAcoustic resonance: Resonance

Data Source

PatentUS11616490B2RF filter circuit including BAW resonators
Publication Date: 2023.03.28 AKOUSTIS TECHNOLOGIES CORP
  • US11616490B2 patent drawing
  • US11616490B2 patent drawing
  • US11616490B2 patent drawing

AI summary

An RF circuit device using modified lattice, lattice, and ladder circuit topologies. The devices can include four resonator devices and four shunt resonator devices. In the ladder topology, the resonator devices are connected in series from an input port to an output port while shunt resonator devices are coupled the nodes between the resonator devices. In the lattice topology, a top and a bottom serial configurations each includes a pair of resonator devices that are coupled to differential input and output ports. A pair of shunt resonators is cross-coupled between each pair of a top serial configuration resonator and a bottom serial configuration resonator. The modified lattice topology adds baluns or inductor devices between top and bottom nodes of the top and bottom serial configurations of the lattice configuration. These topologies may be applied using single crystal or polycrystalline bulk acoustic wave (BAW) resonators.