BAW Package Redistribution Layout With Offset Contact Pads
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Solution Overview
Problem
Current RFIC packaging lacks flexibility in device layout and size reduction due to rigid solder bond layouts, which limits the integration of multi-die RF modules and increases manufacturing constraints.
Innovation Solution
The proposed electronic device package incorporates a base substrate with a conductive column and cap substrate, a dielectric layer, and a redistribution layer with contact pads offset from the through-substrate vias, allowing for increased flexibility in device placement and using low-temperature materials to avoid interference with solder bonds.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If rigid solder bond layouts are used in RFIC packaging, then manufacturing simplicity is maintained, but device layout flexibility and size reduction are limited
Solution Approach 1:
The packaging structure is segmented into multiple functional layers: base substrate, dielectric layer with embedded vias, redistribution layer, and cap substrate. This segmentation allows independent optimization of each layer, enabling flexible device layout while maintaining manufacturing simplicity through standardized layer fabrication processes.
Solution Approach 2:
The invention transitions from a two-dimensional rigid solder bond layout to a three-dimensional packaging structure with vertical vias and offset contact pads. The through-substrate vias extend vertically through the base substrate, and contact pads are positioned at different horizontal locations, enabling flexible device placement without increasing planar footprint.
2Adaptability or versatility
If contact pads are positioned directly below through-substrate vias, then manufacturing alignment is simplified, but mounting flexibility on electronics modules is reduced
Solution Approach 1:
The redistribution layer acts as an intermediary between the through-substrate vias and the contact pads. It redistributes electrical connections from the via locations to offset contact pad positions, decoupling the mechanical alignment requirements from the electrical connection requirements. This allows contact pads to be positioned optimally for mounting flexibility while vias maintain standardized fabrication alignment.
3Reliability
If high-temperature materials are used in packaging, then material strength and reliability are improved, but interference with solder bonds occurs
Solution Approach 1:
The invention changes the temperature parameter of the dielectric material from high-temperature to low-temperature formulations. The dielectric layer is specifically designed to be deposited and cured at temperatures below the solder reflow temperature, eliminating thermal interference with solder bonds while maintaining adequate mechanical strength and electrical insulation properties for reliable packaging.
Data Source
AI summary
An electronic device package comprises an electrical device disposed on a base substrate, a conductive column in electrical communication with the electrical device and having a first end bonded to the base substrate, a cap substrate disposed over the electrical device and bonded to a second end of the conductive column, a layer of dielectric material disposed on the lower surface of the base substrate, a through substrate via in electrical communication with the conductive column and passing through the base substrate and the layer of dielectric material, a redistribution layer disposed on the layer of dielectric material, and a contact pad formed on the redistribution layer and in electrical communication with the through substrate via through the redistribution layer, the contact pad being horizontally displaced from a position directly below the through substrate via.