BAW Package Redistribution Layout for Flexible Pad Placement
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Solution Overview
Problem
Current RFIC and MEMS packaging technologies face challenges in providing flexible device placement and reducing die size due to rigid layout constraints, especially with the use of traditional solder bonds and substrate vias, which limit design flexibility and increase manufacturing complexity.
Innovation Solution
The proposed solution involves an electronic device package with a base substrate, a conductive column, and a cap substrate, along with a layer of organic dielectric buffer coat and a redistribution layer, allowing for a contact pad that is horizontally displaced from the through-substrate via, enabling flexible mounting on a module while using low-temperature materials to avoid damaging hermetic seals.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If traditional solder bonds and substrate vias are used, then structural strength is ensured, but device placement flexibility is limited
Solution Approach 1:
The patent introduces a redistribution layer that redistributes electrical connections in a planar dimension, allowing contact pads to be positioned away from the through-substrate via. This dimensional redistribution enables flexible device placement while maintaining structural integrity through the via connections.
Solution Approach 2:
The redistribution layer acts as an intermediary between the through-substrate via and the contact pad, enabling the contact pad to be horizontally displaced from the via position. This intermediary structure provides both mechanical support and electrical connection flexibility.
2Strength
If high-temperature processing is used for solder bonds, then bonding strength is improved, but hermetic seals are damaged
Solution Approach 1:
The hermetic seal is formed and cured before the solder bonding process. This preliminary action ensures the seal is already in place and protected during subsequent high-temperature soldering operations, preventing damage to the seal while allowing strong bonding.
Solution Approach 2:
The process sequence is designed to complete temperature-sensitive hermetic seal formation before exposing the structure to high-temperature solder bonding. This beforehand cushioning protects the seal from thermal damage while still achieving strong mechanical bonds.
3Adaptability or versatility
If contact pad is positioned directly below through-substrate via, then manufacturing simplicity is maintained, but mounting flexibility is reduced
Solution Approach 1:
The redistribution layer enables horizontal displacement of the contact pad from the vertical projection of the through-substrate via. This planar redistribution provides mounting flexibility without adding significant manufacturing complexity, as the redistribution layer can be formed using standard PCB or semiconductor fabrication techniques.
Data Source
AI summary
An electronic device package comprises an electrical device disposed on a base substrate, a conductive column in electrical communication with the electrical device and having a first end bonded to the base substrate, a cap substrate disposed over the electrical device and bonded to a second end of the conductive column, a layer of organic dielectric buffer coat material on the lower surface of the base substrate, a through substrate via in electrical communication with the conductive column and passing through the base substrate and the layer of organic dielectric buffer coat material, a redistribution layer disposed on the layer of organic dielectric buffer coat material, and a contact pad formed on the redistribution layer and in electrical communication with the through substrate via through the redistribution layer, the contact pad being horizontally displaced from a position directly below the through substrate via.