Low-Modulus BAW Package Structure for Vibration Isolation
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Solution Overview
Problem
The performance of bulk acoustic wave (BAW) devices is degraded due to undesirable effects from vibrations in the substrate and mold compound, which alter the device's acoustic characteristics and response frequencies.
Innovation Solution
A BAW package is designed with an electrical connection substrate of low Young's modulus material (<10 MPa) and a mold compound layer of low Young's modulus (<100 MPa) to encapsulate the BAW device, reducing the impact of substrate and mold compound vibrations on device performance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If traditional substrate and mold compound materials are used, then structural support and encapsulation are provided, but vibrations in these materials degrade the BAW device performance and alter acoustic characteristics
Solution Approach 1:
The patent changes the physical parameter of the substrate and mold compound by selecting materials with low Young's modulus. This parameter change reduces the stiffness of these materials, thereby minimizing their vibration characteristics and the resulting degradation of BAW device performance while still providing adequate structural support and encapsulation.
2Object-affected harmful factors
If low Young's modulus materials are used for substrate and mold compound, then vibration impact on device is reduced, but structural strength and support capability are compromised
Solution Approach 1:
The patent optimizes the Young's modulus parameter of the substrate and mold compound materials to achieve a balance between reducing vibrations and maintaining adequate structural strength. The low Young's modulus reduces vibration impact on the BAW device while the materials still provide sufficient mechanical support for the package structure.
Data Source
AI summary
An assembly including an electrical connection substrate formed of material having a Young's modulus of less than about 10 MPa, an acoustic device die having opposite end portions mounted on and electrically connected to the electrical connection substrate and a mold compound layer encapsulating the acoustic device die and interfacing with the substrate.