BAW Component Plasma Dicing to Minimize Edge Chipping
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Solution Overview
Problem
Existing bulk acoustic wave (BAW) components face challenges in reducing size without compromising reliability and performance, as packaging structures contribute to their size and mechanical dicing methods can lead to chipping and cracking.
Innovation Solution
A method involving plasma dicing is used to singulate BAW components by forming a buffer layer over the substrate, creating exposed streets for dicing, which reduces chipping and allows for closer sidewall placement to the edge of the component, enabling smaller sizes and improved yield.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If mechanical dicing methods are used to singulate BAW components, then manufacturing simplicity is maintained, but chipping and cracking occur leading to reduced reliability
Solution Approach 1:
The patent replaces mechanical dicing methods with plasma dicing, substituting physical contact-based cutting with a chemical etching process. This eliminates the mechanical forces that cause chipping and cracking, thereby improving component reliability while maintaining manufacturing feasibility through a controlled plasma etching process
2Reliability
If packaging structures are added to enclose BAW resonators, then reliability is improved, but component size increases
Solution Approach 1:
The patent changes the critical parameter of sidewall-to-edge distance from the conventional 15-20 microns to 5 microns or less by implementing plasma dicing. This parameter change allows the sidewall to be positioned much closer to the diced edge without causing chipping, thereby reducing the required packaging structure size while maintaining reliability
3Productivity
If conventional dicing methods are used, then manufacturing process simplicity is maintained, but manufacturing yield decreases due to chipping and cracking
Solution Approach 1:
The patent replaces mechanical dicing with plasma dicing, substituting a simple but damaging mechanical process with a more complex chemical etching process that delivers superior results. The plasma dicing process achieves 10% to 18% yield improvement by eliminating chipping and cracking, justifying the increased process complexity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The plasma dicing method effectively reduces the size of BAW components, enhances reliability by minimizing chipping and cracking, and improves manufacturing yield, leading to cost savings and more efficient use of module space.
Implementation Method 1
plasma dicing the bulk acoustic wave components along the exposed streets to thereby singulate the bulk acoustic wave components
Data Source
AI summary
Aspects of this disclosure relate to methods of manufacturing bulk acoustic wave components. Such methods include plasma dicing to singulate individual bulk acoustic wave components. A buffer layer can be formed over a substrate of bulk acoustic wave components such that streets are exposed. The bulk acoustic wave components can be plasma diced along the exposed streets to thereby singulate the bulk acoustic wave components