BAW Resonator Bonding Structure with Blocking Portions
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Solution Overview
Problem
The existing methods for bonding bulk acoustic wave (BAW) resonators at high temperatures result in uneven bonding surfaces due to thermal diffusion or eutectic bonding, leading to cracks and reduced yield, and require excessive bonding material to compensate for thickness variations, increasing costs.
Innovation Solution
A novel bonding structure that includes a blocking portion around the bonding portion, using a first bonding layer and a second bonding layer with a blocking layer or groove to control the flow of bonding material, allowing for sufficient bonding with a minimal amount of material regardless of thickness distribution.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If eutectic bonding or transient liquid phase bonding is used to hermetically seal BAW resonators at low temperature, then bonding temperature is reduced to 500°C or less, but bonding surface becomes uneven due to thickness variation, causing cracks and reduced yield
Solution Approach 1:
A blocking portion is formed in advance around the bonding portion before bonding occurs. This blocking structure pre-defines the bonding area and prevents material flow beyond the intended region, ensuring uniform bonding surface even when substrate thickness varies
Solution Approach 2:
The blocking portion is localized around the bonding portion rather than covering the entire substrate. This localized approach provides precise control over bonding material flow only where needed, maintaining bonding surface uniformity without affecting other areas
2Manufacturing precision
If a sufficient amount of bonding material is applied to compensate for thickness variation, then bonding surface uniformity is improved, but bonding material thickness increases and raw material cost rises
Solution Approach 1:
The blocking portion is formed beforehand to define precise bonding boundaries. This pre-defined structure ensures bonding material is confined to the exact area needed, preventing excess material application while maintaining uniform bonding surface
Solution Approach 2:
The blocking portion changes the spatial distribution parameters of bonding material, confining it to a specific region. This parameter control allows uniform bonding surface with minimized material quantity by preventing lateral flow
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach ensures a strong and even bond with reduced material usage, enhancing the yield and cost-effectiveness of the bonding process for BAW resonators.
Implementation Method 1
The eutectic bonding includes transient liquid phase bonding
Implementation Method 2
The eutectic bonding includes transient liquid phase bonding
Implementation Method 3
a blocking portion that may significantly reduce the flow of a bonding material may be formed around a bonding portion
Data Source
AI summary
The present disclosure relates to an electronic element package and a method of manufacturing the same. The electronic element package includes a substrate, an element disposed on the substrate, a cap enclosing the element, a bonding portion bonding the substrate to the cap, and blocking portions disposed on both sides of the bonding portion.