BAW Resonator Cavity Frame for Thermal Stability and Isolation

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Solution Overview

Problem

Bulk acoustic wave resonators face challenges in achieving stable structural integrity and thermal management due to issues with acoustic isolation from substrates, which affects their frequency stability and performance, particularly because existing methods for creating cavities lack control over depth and shape, and can damage circuit elements.

Innovation Solution

A bulk acoustic resonator design that incorporates a cavity frame and planarizing material to enhance structural integrity, along with a heat dissipation frame made from high thermal conductivity materials to manage heat and reduce frequency shifts, while using a sacrificial layer etching process that allows for precise cavity formation.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Loss of energy

If a cavity is formed using liquid etchant to remove sacrificial material, then acoustic isolation is improved, but structural stability deteriorates and circuit elements are damaged

Engineering Contradiction:
Improveacoustic energy leakageVSAvoidstructural stability
Core Design Contradiction:
Loss of energyVSReliability

Solution Approach 1:

The patent introduces an intermediary support structure consisting of release agent and hard mask layers that mediate between the liquid etchant and the resonator stack. This intermediary layer protects the resonator stack from direct exposure to the etchant while allowing the etchant to effectively remove the sacrificial material and form the acoustic isolation cavity.

Inventive Principle:
Principle #24Intermediary (Mediator)

Solution Approach 2:

The patent applies a release agent layer beforehand to cushion and protect the resonator stack from damage during the etching process. This pre-applied protective layer prevents direct contact between the liquid etchant and the resonator stack, maintaining structural stability while enabling effective acoustic isolation.

Inventive Principle:
Principle #11Beforehand cushioning (Prior cushioning)

2Loss of energy

If resonator stack is suspended only on metal columns over cavity, then acoustic isolation is improved, but structural stability deteriorates

Engineering Contradiction:
Improveacoustic energy leakageVSAvoidstructural integrity
Core Design Contradiction:
Loss of energyVSStrength

Solution Approach 1:

The patent segments the support function by introducing multiple distinct layers (release agent layer and hard mask layer) in addition to the metal columns. This segmentation distributes the mechanical support load across multiple structural elements, enhancing overall structural integrity while maintaining acoustic isolation through the cavity formation.

Inventive Principle:
Principle #1Segmentation

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution improves the structural integrity and thermal stability of the resonator, reducing acoustic energy leakage and temperature-induced frequency shifts, thereby enhancing the resonator's performance and reliability.

Implementation Method 1

When an electrical signal is applied to the top and bottom electrodes, the piezoelectric thin film layer converts the electrical energy of the signal into mechanical energy (also referred to herein as acoustical energy). An oscillating electrical signal applied to the piezoelectric thin film layer causes pressure and/or shear waves to propagate through the bulk of the BAW stack.

Methodology Applied
Scientific EffectPiezoelectric effect: Piezoelectric Effect

Implementation Method 2

a heat dissipation frame made from high thermal conductivity materials to manage heat and reduce frequency shifts

Methodology Applied
Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentUS11764750B2Support structure for bulk acoustic wave resonator
Publication Date: 2023.09.19 GLOBAL COMMUNICATION SEMICONDUCTORS LLC
  • US11764750B2 patent drawing
  • US11764750B2 patent drawing
  • US11764750B2 patent drawing

AI summary

Devices and processes for preparing devices are described for a bulk acoustic wave resonator. A stack includes a first electrode that is coupled to a first side of a piezoelectric layer and a second electrode that is coupled to a second side of the piezoelectric layer. The stack is configured to resonate in response to an electrical signal applied between the first electrode and the second electrode. A cavity frame is coupled to the first electrode and to the substrate. The cavity frame forms a perimeter around a cavity. Optionally, a heat dissipating frame is formed and coupled to the second electrode. The cavity frame and/or the heat dissipating frame improve the thermal stability of the bulk acoustic resonator.