Bulk acoustic wave resonator and electronic device
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Solution Overview
Problem
Existing bulk acoustic wave resonators face challenges in reducing insertion loss and maintaining performance due to heat generation from electromagnetic wave energy conversion, leading to temperature increases that can cause device failure.
Innovation Solution
Incorporating a first heat conduction layer on the bulk acoustic wave resonator's base substrate to efficiently guide heat away from the device, combined with additional heat conduction layers and vias to enhance thermal management, and using isolation layers to minimize electromagnetic wave leakage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a conventional bulk acoustic wave resonator structure is used, then the device structure is simple, but heat accumulates causing temperature rise and device failure
Solution Approach 1:
The patent introduces a heat conduction layer as an intermediary component between the piezoelectric layer and the base substrate. This layer specifically addresses heat accumulation by providing a dedicated thermal conduction path, allowing heat to be efficiently transferred away from the active resonator components without interfering with the acoustic wave functionality.
Solution Approach 2:
The patent segments the heat conduction function from the structural support function by introducing a separate heat conduction layer. This segmentation allows the base substrate to maintain its mechanical support role while the dedicated heat conduction layer handles thermal management, improving overall heat dissipation efficiency.
2Loss of energy
If acoustic wave reflectors are added to limit acoustic wave signal diffusion, then insertion loss is reduced, but device complexity increases
Solution Approach 1:
The patent makes the base substrate multi-functional by requiring it to serve both as the acoustic wave reflector and as the mounting surface for the piezoelectric layer. This eliminates the need for a separate reflector structure, reducing device complexity while maintaining the ability to limit acoustic wave signal diffusion and reduce insertion loss.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively reduces the risk of device failure from temperature rises, maintaining performance and reducing insertion loss by timely dissipation of heat, thereby ensuring reliable operation.
Implementation Method 1
converted into an acoustic wave signal of mechanical vibration at an interface of the piezoelectric material and the metal electrode through an inverse piezoelectric effect
Implementation Method 2
converted into the radio frequency signal at the interface of the metal electrode and the piezoelectric material through a piezoelectric effect
Implementation Method 3
a first heat conduction layer on a side of the first electrode close to the base substrate
Data Source
AI summary
The present disclosure provides a bulk acoustic wave resonator and an electronic device, and belongs to the field of communication technology. The bulk acoustic wave resonator of the present disclosure includes: a base substrate, a first electrode, a piezoelectric layer, and a second electrode; the first electrode is on the base substrate, the second electrode is on a side of the first electrode away from the base substrate, the piezoelectric layer is between the first electrode and the second electrode; and orthographic projections of any two of the first electrode, the piezoelectric layer and the second electrode on the base substrate at least partially overlap with each other; wherein the bulk acoustic wave resonator further includes: a first heat conduction layer on a side of the first electrode close to the base substrate.