BAW Resonators With Patterned Mass Loading for Multi-Frequency Tuning
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Solution Overview
Problem
Manufacturing bulk acoustic wave resonators with multiple resonant frequencies is complex and costly due to the need for multiple processing steps, which increases the complexity and expense as more resonators with different frequencies are produced on a common die.
Innovation Solution
The use of patterned mass loading layers with different densities, formed during a common processing step, allows for the adjustment of resonant frequencies by varying the density and duty factor of the mass loading layers, enabling multiple resonant frequencies to be achieved with reduced processing complexity and cost.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If multiple processing steps are used to manufacture BAW resonators with different resonant frequencies, then resonant frequency precision is improved, but device complexity and manufacturing cost increase
Solution Approach 1:
The patent applies parameter changes by varying the density of the mass loading layer to adjust resonant frequency. Instead of using multiple processing steps to create different resonators, the invention changes the density parameter of a single mass loading layer to achieve different resonant frequencies, thereby simplifying the manufacturing process while maintaining frequency precision
Solution Approach 2:
The mass loading layer serves multiple functions: it provides mass loading to the piezoelectric layer and simultaneously enables frequency tuning through density variation. This universal approach allows a single structure to achieve multiple resonant frequencies without requiring separate processing steps for each frequency, reducing overall device complexity
2Manufacturing precision
If multiple processing steps are used to manufacture BAW resonators with different resonant frequencies, then resonant frequency precision is improved, but manufacturing cost increases
Solution Approach 1:
By changing the density parameter of the mass loading layer, the patent enables frequency adjustment without additional processing steps. This parameter-based approach reduces manufacturing complexity and associated costs while maintaining the ability to precisely control resonant frequencies
Solution Approach 2:
The invention merges the frequency-tuning function into the mass loading layer itself, combining what would traditionally require separate processing steps into a single integrated structure. This consolidation reduces manufacturing complexity and cost while achieving the desired frequency precision
3Adaptability or versatility
If patterned mass loading layers with different densities are used, then resonant frequency tuning flexibility is improved, but manufacturing precision requirements increase
Solution Approach 1:
The patent utilizes density as a tunable parameter to achieve flexible resonant frequency control. By varying the density of the mass loading layer, the invention provides adaptability for different frequency requirements while managing manufacturing precision through a single controllable parameter rather than multiple processing steps
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach simplifies the manufacturing process by allowing multiple resonant frequencies to be tuned within a single parameter, reducing the number of processing steps and enhancing flexibility in producing resonators with varying frequencies for use in filters and multiplexers.
Implementation Method 1
In BAW resonators, acoustic waves propagate in a bulk of a piezoelectric layer
Implementation Method 2
acoustic waves propagate in a bulk of a piezoelectric layer
Data Source
AI summary
Aspects of this disclosure relate to bulk acoustic wave resonators with patterned mass loading layers. Two different bulk acoustic wave resonators of an acoustic wave filter and/or an acoustic wave die have respective patterned mass loading layers with different densities. The patterned mass loading layers contribute to the two different bulk acoustic wave resonators having different respective resonant frequencies. Related bulk acoustic wave devices, filters, acoustic wave dies, radio frequency modules, wireless communication devices, and methods are disclosed.


