BAW Component Sidewall Layout for Plasma-Diced Edge Reliability
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Solution Overview
Problem
Existing bulk acoustic wave (BAW) components face challenges in reducing size without compromising reliability and performance, as packaging structures contribute to their size and mechanical dicing techniques often result in chipping and cracking.
Innovation Solution
A method involving plasma dicing of BAW components, where a buffer layer is formed to expose streets for dicing, allowing for singulation with reduced chipping risk and closer sidewall proximity to the diced edge, using silicon substrates and copper sidewalls, and forming conductive layers and solder without overlapping vias.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If mechanical dicing techniques are used to singulate BAW components, then the components can be separated for packaging, but chipping and cracking occur that reduce reliability
Solution Approach 1:
The patent replaces mechanical dicing techniques with plasma dicing, which uses plasma chemistry rather than mechanical forces to separate the BAW components. This substitution eliminates the chipping and cracking problems associated with mechanical contact while maintaining effective component singulation capability
2Reliability
If packaging structures are added to enclose BAW resonators, then reliability is improved through protection, but the overall size of the BAW component increases
Solution Approach 1:
The patent implements nesting by placing the BAW resonator inside a cap structure that encloses it, with the resonator nested within the protective cap. This nested arrangement provides protection while minimizing the overall volume compared to alternative packaging approaches
Solution Approach 2:
The cap structure uses thin film walls to provide protection for the resonator while minimizing the volume occupied by the packaging structure. The thin film approach allows adequate protection without adding excessive size to the overall component
3Volume of moving object
If the sidewall is placed closer to the diced edge to reduce size, then component volume is reduced, but mechanical stress and chipping risk increase
Solution Approach 1:
The patent uses plasma dicing instead of mechanical dicing to create the diced edge, which eliminates mechanical stress during the separation process. This allows the sidewall to be placed very close to the edge (within 5 microns) without the increased chipping risk that would normally accompany such close proximity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces the size of BAW components, improves yield by 10-18%, and enhances reliability by minimizing mechanical stress and chipping, while maintaining sharp edges and rounded corners for improved performance.
Implementation Method 1
plasma dicing the bulk acoustic wave components along the exposed streets to thereby singulate the bulk acoustic wave components
Data Source
AI summary
Aspects of this disclosure relate to methods of manufacturing bulk acoustic wave components. Such methods include plasma dicing to singulate individual bulk acoustic wave components. A buffer layer can be formed over a substrate of bulk acoustic wave components such that streets are exposed. The bulk acoustic wave components can be plasma diced along the exposed streets to thereby singulate the bulk acoustic wave components.