Bayesian Inference for Semiconductor Metrology Spatial Distribution
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Solution Overview
Problem
Current process control methods in semiconductor manufacturing, particularly in lithographic processes, rely on modelled metrology data based on base functions that are not optimized by domain knowledge or actual observed characteristics, leading to potential fitting of incorrect or poor models.
Innovation Solution
A method using Bayesian inference to determine the spatial distribution of a parameter of interest on a substrate, by obtaining a statistical description of the expected fingerprint component and noise component, and inferring the spatial distribution using this prior and metrology data as an observation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If base function based modelling is used for process control, then the modelling process is simple and fast, but the accuracy of fitting metrology data is poor and may lead to incorrect models
Solution Approach 1:
The patent changes the approach from using fixed base functions to using a probabilistic model where parameters are inferred from data. The model uses a prior distribution over possible parameter values and updates it with observed metrology data to obtain a posterior distribution, allowing the model to adapt to actual observed characteristics rather than forcing data into predetermined functional forms.
Solution Approach 2:
The patent implements feedback by using observed metrology data to update the model parameters through Bayesian inference. The measured overlay errors and other metrology parameters provide feedback that refines the spatial distribution model, allowing the system to learn from actual measurements and improve its accuracy iteratively.
2Reliability
If statistical description with Bayesian inference is used, then the accuracy of spatial distribution estimation is improved, but the computational complexity and processing time increase
Solution Approach 1:
The patent applies preliminary action by using a prior distribution that encapsulates existing knowledge and expectations about the spatial distribution before new measurements are taken. This prior can be pre-computed and stored, avoiding the need to perform complex computational operations from scratch for each new measurement, thus reducing processing time while maintaining reliability.
Solution Approach 2:
The patent uses partial action by focusing the Bayesian inference on the specific parameters and regions most relevant to the current measurement task, rather than performing complete re-evaluation of all possible spatial distributions. This selective approach reduces computational burden while maintaining sufficient accuracy for process control.
3Manufacturing precision
If modelled metrology data is used without domain knowledge, then the process control can be implemented quickly, but the model may not reflect actual observed characteristics leading to incorrect corrections
Solution Approach 1:
The patent applies self-service by allowing the model to automatically adapt to actual observed characteristics through Bayesian inference. The system uses the measured metrology data itself to refine the spatial distribution model, eliminating the need for manual intervention to adjust model parameters based on domain knowledge. The data speaks for itself in updating the model, combining ease of implementation with high accuracy.
Data Source
AI summary
A method for determining a spatial distribution of a parameter of interest over at least one substrate or portion thereof, the at least one substrate having been subject to a semiconductor manufacturing process, the method including: obtaining a statistical description describing an expected fingerprint component of the spatial distribution and a noise component describing an expected level of measurement noise associated with the parameter of interest; obtaining metrology data related to the parameter of interest; and inferring via Bayesian inference the spatial distribution of the parameter of interest over the at least one substrate or portion thereof, using the statistical description as a prior and the metrology data as an observation.

