Bump-less Build-up Layer Package for Compact Stacking
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Solution Overview
Problem
The increasing demand for smaller electronic devices with enhanced functionality poses a challenge in integrating circuit packages without increasing z-height, as traditional methods require elevating the top package to clear the bottom package die, leading to space inefficiencies.
Innovation Solution
The implementation of a bump-less build-up layer (BBUL) package design, which allows for the stacking of packages by using conductive traces and through-via connections to establish electrical coupling without the need for physical elevation, enabling efficient space utilization and heat dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If traditional package elevation methods are used to clear the bottom package die, then electrical connectivity is maintained, but z-height increases and space efficiency deteriorates
Solution Approach 1:
The patent introduces an intermediary build-up layer structure with through-vias that mediates between the bottom and top packages. This layer provides electrical connectivity through conductive traces and vias while allowing the top package to sit flush against the bottom package, eliminating the need for elevation and reducing z-height.
Solution Approach 2:
The patent transitions from traditional vertical elevation to a planar routing solution by implementing conductive traces and through-vias within the build-up layer. This allows electrical connections to be established in the horizontal plane rather than requiring vertical separation, effectively using another dimension for signal routing.
2Area of stationary object
If package stacking is implemented to conserve space, then area utilization improves, but z-height increases due to required elevation
Solution Approach 1:
The patent implements a nested package structure where the top package is positioned within the footprint of the bottom package, maximizing area utilization. The build-up layer with through-vias enables this nesting by providing electrical connections without requiring the top package to extend beyond the bottom package boundaries in the z-direction.
3Volume of moving object
If bump-less build-up layer design is used, then space efficiency improves and heat dissipation is enhanced, but manufacturing complexity increases
Solution Approach 1:
The patent segments the electrical connection function into distinct components: build-up layers for signal routing, through-vias for vertical connections, and contact pads for interface points. This segmentation allows each component to be optimized independently while maintaining overall simplicity and enabling better heat dissipation through the distributed structure.
Data Source
AI summary
In some embodiments, package on package using a bump-less build up layer (BBUL) package is presented. In this regard, an apparatus is introduced comprising a microelectronic die having an active surface, an inactive surface parallel to said active surface, and at least one side, an encapsulation material adjacent said at least one microelectronic die side, wherein said encapsulation material includes a bottom surface substantially planar to said microelectronic die active surface and a top surface substantially planar to said microelectronic die inactive surface, a through via connection in said encapsulation material extending from said top surface to said bottom surface, a first dielectric material layer disposed on at least a portion of said microelectronic die active surface and said encapsulation material surface, a plurality of build-up layers disposed on said first dielectric material layer, and a plurality of conductive traces disposed on said first dielectric material layer and said build-up layers and in electrical contact with said microelectronic die active surface. Other embodiments are also disclosed and claimed.