Battery Disconnecting Unit Cooling Plate With Thermal Interface Material

The patent transitions from two-dimensional planar cooling surfaces to three-dimensional ribbed structures. The primary and secondary ribs create a hierarchical surface topology that dramatically increases cooling surface area without extending busbar length, thereby maintaining electrical conductivity while enhancing thermal dissipation capability.

The patent implements a nested rib structure where primary ribs contain secondary ribs that extend from the housing toward the center. This nested arrangement maximizes surface area within the available spatial envelope, providing extensive cooling surface without increasing the overall footprint or busbar length.

The ribbed structure transforms the cooling approach by adding vertical and lateral dimensions to heat dissipation. Heat is conducted through the busbar and dissipated across the multi-level rib surfaces, increasing effective surface area for convection and radiation without requiring longer busbar paths that would generate more internal heat.

The patent applies different rib configurations to different regions of the busbar housing. Primary ribs provide baseline cooling surface area, while secondary ribs concentrate additional cooling capacity in specific high-heat zones, optimizing heat dissipation where most needed without uniformly increasing power loss across the entire busbar length.