Charged Particle Beam Alignment for Layered Cross-Section Angles
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Solution Overview
Problem
Existing charged particle beam devices face challenges in accurately processing samples with layered structures laterally or perpendicularly to the layers, as they struggle to maintain precise orientation and angle control during cross-section processing.
Innovation Solution
A control method and device that utilize a focused ion beam to process the sample's cross-section at a predetermined angle, incorporating an image generation step, angle deviation calculation, and correction step to adjust the sample's orientation or electron beam direction based on observation images, ensuring accurate processing by calculating and eliminating angle deviations using specific formulas.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional charged particle beam devices process samples with layered structures, then processing can be performed, but accurate lateral or perpendicular processing with respect to the layers cannot be achieved due to orientation and angle control issues
Solution Approach 1:
The system captures observation images of the sample cross-section, calculates the actual angle of the layers relative to the processing direction, and uses this feedback information to adjust the processing parameters. This closed-loop feedback mechanism enables accurate angular measurement and correction, resolving the contradiction between processing capability and measurement precision.
Solution Approach 2:
The patent replaces mechanical angle measurement and alignment systems with an image-based optical measurement system. By capturing images and calculating angles through image processing algorithms, the system achieves high-precision angular measurement without relying on complex mechanical goniometers or alignment mechanisms.
2Manufacturing precision
If the sample orientation is not precisely controlled, then processing can be performed quickly, but the processing will not be accurate laterally or perpendicularly to the layers
Solution Approach 1:
The system performs self-alignment by automatically capturing observation images, calculating the layer angles, and adjusting the processing parameters without requiring external alignment equipment or complex manual calibration procedures. The device uses its own imaging and processing capabilities to determine and correct its orientation.
Solution Approach 2:
The system dynamically adjusts processing parameters such as beam angle, sample tilt, and processing direction based on the measured layer orientation. By changing these parameters according to the calculated angles, the system achieves accurate processing relative to the layers without requiring complex mechanical reconfiguration.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables high-accuracy processing of samples with layered structures by accurately determining and correcting angle deviations, allowing for precise lateral or perpendicular processing with respect to the sample's layers.
Implementation Method 1
irradiating a sample with an electron beam, detecting secondary electrons or reflected electrons generated from the sample
Implementation Method 2
detecting secondary electrons or reflected electrons generated from the sample
Implementation Method 3
irradiating a sample in which a plurality of layers is laminated, with a focused ion beam thereby processing a cross-section of the sample
Data Source
AI summary
The present invention provides a control method for a charged particle beam device for irradiating a sample in which a plurality of layers is laminated with a focused ion beam to process a cross-section of the sample at a processing angle that is a prescribed angle. The control method includes: an image generation step for irradiating the sample with an electron beam, detecting secondary electrons or reflected electrons generated from the sample, and generating an observation image of a cross-section of the sample based on results of detection; an angle deviation calculation step for calculating the angle deviation between the angle of the cross-section and the processing angle based on the observation image; and a control step for controlling orientation of the sample or a direction of radiation with the electron beam so as to eliminate the angle deviation calculated in the angle deviation calculation step.