Charged Particle Beam Apparatus Stage Segmentation

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Solution Overview

Problem

Conventional composite charged particle beam apparatuses face challenges in acquiring high-resolution SEM images due to limitations in working distance and stage size, leading to interference issues and reduced detection efficiency, resulting in low-contrast images with inaccurate aspect ratios.

Innovation Solution

A charged particle beam apparatus and method that involves a focused ion beam column, electron beam column, and a sample piece support to move the sample piece closer to the electron beam column, allowing for high-resolution SEM imaging without changing the stage size, and includes processes for sample piece formation, cross-section processing, and SEM image acquisition with angle adjustments and drift correction.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Measurement precision

If the working distance between electron beam column and sample is narrowed to acquire high-resolution SEM image, then measurement precision is improved, but device complexity increases due to interference between stage and electron beam column

Engineering Contradiction:
ImproveSEM image resolutionVSAvoidinterference between stage and electron beam column
Core Design Contradiction:
Measurement precisionVSDevice complexity

Solution Approach 1:

The sample observation system is divided into two independent stages: a large stage for sample placement and a reduced dedicated stage for observation. This segmentation allows the observation stage to be positioned close to the electron beam column for high-resolution imaging while the large stage remains separate for sample handling.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

A transfer mechanism acts as an intermediary between the large stage and the reduced observation stage. This intermediary transfers the observation target portion from the large stage to the reduced stage, enabling close positioning for high-resolution SEM imaging without requiring the entire large stage to be close to the electron beam column.

Inventive Principle:
Principle #24Intermediary (Mediator)

2Device complexity

If the stage size is reduced to avoid interference with electron beam column, then device complexity is reduced, but the size of sample that can be placed is limited

Engineering Contradiction:
Improvestage sizeVSAvoidsample placement area
Core Design Contradiction:
Device complexityVSArea of stationary object

Solution Approach 1:

The sample observation system is divided into two independent stages: a large stage for sample placement and a reduced dedicated stage for observation. This segmentation allows the observation stage to be positioned close to the electron beam column for high-resolution imaging while the large stage remains separate for sample handling.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The system transitions from a single-stage two-dimensional problem to a multi-stage three-dimensional arrangement. By adding the vertical dimension of stage transfer and positioning, the system accommodates both large sample placement area and close observation distance simultaneously in different spatial dimensions.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

3Measurement precision

If observation target portion is transferred from large stage to reduced dedicated stage, then measurement precision is improved, but loss of information occurs due to electric field distribution changes

Engineering Contradiction:
ImproveSEM image contrastVSAvoidelectric field distribution
Core Design Contradiction:
Measurement precisionVSLoss of information

Solution Approach 1:

The control device adjusts operating parameters including electric field distribution when the observation target portion is transferred between stages. By dynamically changing these parameters to match the new positioning, the system maintains optimal detection efficiency and image contrast despite the stage transfer.

Inventive Principle:
Principle #35Parameter changes

4Device complexity

If conventional observation angle of 54 degrees is used, then device complexity is reduced, but manufacturing precision is worsened due to image contraction

Engineering Contradiction:
Improveobservation angle configurationVSAvoidaspect ratio accuracy
Core Design Contradiction:
Device complexityVSManufacturing precision

Solution Approach 1:

The observation angle is made dynamically adjustable rather than fixed at the conventional 54 degrees. The electron beam column or sample stage can be positioned to achieve different observation angles, allowing optimization for accurate aspect ratio representation while maintaining ease of operation through automated control.

Inventive Principle:
Principle #15Dynamics

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Enables high-resolution SEM imaging with improved contrast and accurate representation of sample cross-sections, reducing the need for stage size reduction and minimizing electric field distribution changes, thus enhancing the precision and clarity of the acquired images.

Implementation Method 1

an electron beam column emitting an electron beam

Methodology Applied
Scientific EffectSecondary electron emission: Photoelectric Effect

Implementation Method 2

a focused ion beam column emitting a focused ion beam

Methodology Applied
Scientific EffectIon beam sputtering: Ion Beam

Data Source

PatentUS11282672B2Charged particle beam apparatus and sample processing observation method
Publication Date: 2022.03.22 HITACHI HIGH TECH ANALYSIS CORP
  • US11282672B2 patent drawing
  • US11282672B2 patent drawing
  • US11282672B2 patent drawing

AI summary

Disclosed are a charged particle beam apparatus and a sample processing observation method, the method including: a sample piece formation process in which a sample is irradiated with a focused ion beam such that a sample piece is cut out from the sample; a cross-section processing process in which the sample piece support holds the sample piece and a cross section thereof is irradiated with the ion beam to process the cross section; a sample piece approach movement process in which the sample piece support holds the sample piece and the sample piece is moved to a position that is closer to an electron beam column than an intersection point of beam optical axes of the ion beam and an electron beam is; and a SEM image acquisition process in which the cross section is irradiated with the electron beam to acquire the SEM image of the cross section.