Charged Particle Beam Lithography Local Density Dose Optimization
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Charged particle beam lithography is hindered by the time-consuming process of exposing patterns on surfaces, particularly for complex integrated circuit designs, due to the high dose required for precise feature writing, which increases costs and reduces efficiency.
Innovation Solution
The method involves calculating a pre-proximity effect correction (PEC) maximum dose dynamically based on local pattern density and introducing an artificial background dose in low-density areas to reduce the overall exposure time and dose required for pattern writing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a high dose is used for precise feature writing in charged particle beam lithography, then manufacturing precision is improved, but write time increases and productivity decreases
Solution Approach 1:
The patent applies local quality by determining different maximum doses for different local pattern densities within the exposure area. Low-density areas receive a higher pre-PEC maximum dose to reduce write time, while high-density areas receive a lower dose to maintain precision. This spatial variation in dose parameters resolves the contradiction between precision and productivity by optimizing each local region according to its specific pattern density characteristics.
Solution Approach 2:
The patent implements dynamics by dynamically adjusting the pre-PEC maximum dose parameter based on the calculated local pattern density. Rather than using a fixed dose for the entire exposure area, the system adapts the dose parameters in real-time according to the varying pattern densities across different regions, enabling flexible optimization that balances precision requirements with productivity goals.
2Manufacturing precision
If a high dose is applied to ensure pattern fidelity, then manufacturing precision is improved, but energy consumption increases
Solution Approach 1:
The patent reduces energy consumption by applying local quality principles - each region receives only the dose necessary for its specific pattern density requirements. Low-density areas that can tolerate higher doses receive optimized exposure parameters, while high-density areas receive appropriate lower doses. This prevents unnecessary energy expenditure in regions where high dose is not critical for pattern fidelity.
Solution Approach 2:
The patent changes the dose parameters dynamically based on local pattern density calculations. By modifying the pre-PEC maximum dose and other exposure parameters according to the specific characteristics of each region, the system achieves pattern fidelity where needed while minimizing energy consumption in regions where full dose is not required.
3Productivity
If the exposure process is optimized for speed, then productivity is improved, but manufacturing precision deteriorates
Solution Approach 1:
The patent resolves this contradiction by applying different exposure parameters to different local regions based on their pattern density characteristics. High-density areas requiring precision for accurate pattern formation receive optimized dose parameters that ensure manufacturing precision, while low-density areas receive parameters optimized for faster exposure. This local optimization allows the system to achieve both speed and precision in their respective appropriate contexts.
Solution Approach 2:
The system dynamically adjusts exposure parameters including pre-PEC maximum dose and other dose-related settings based on real-time calculation of local pattern density. This dynamic adaptation enables the exposure process to automatically optimize for speed in appropriate regions while maintaining precision where required, resolving the contradiction between productivity and manufacturing precision.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces the write time and dose needed for pattern exposure, enhancing the efficiency and cost-effectiveness of charged particle beam lithography by optimizing the exposure process through dynamic dose adjustment and artificial background dose application.
Implementation Method 1
charged particle beams shoot energy to a resist-coated surface to expose the resist
Implementation Method 2
charged particle beams shoot energy to a resist-coated surface to expose the resist
Implementation Method 3
pre-proximity effect correction (PEC) maximum dose dynamically based on local pattern density
Data Source
AI summary
A method for exposing a pattern in an area on a surface using a charged particle beam system is disclosed and includes determining a local pattern density for the area of the pattern based on an original set of exposure information. A pre-PEC maximum dose is determined for the area. The original set of exposure information is modified with the pre-PLC maximum dose.