Charged Particle Beam Sputter Coating for Work Piece Protection
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Solution Overview
Problem
Charged particle beam processing can damage sensitive work pieces and cause charging issues, leading to reduced image resolution and contamination when applying coatings, as existing methods require direct beam impact or costly sputter systems that are not suitable for all samples.
Innovation Solution
A method and apparatus for sputter coating a work piece surface within a charged particle beam system, where the charged particle beam is directed at a source material to sputter material onto the work piece, minimizing direct beam impact and allowing in-situ coating in the same vacuum chamber, using a sputter material source like a GIS nozzle or micromanipulator, enabling protective or conductive layer application without moving the work piece.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If a charged particle beam is directed at the work piece surface to deposit material, then coating can be applied, but the work piece surface is damaged
Solution Approach 1:
A sputter source is introduced as an intermediary component between the charged particle beam and the work piece. The beam deposits material onto the sputter source, which then transfers the material to the work piece surface through a separate mechanism, preventing direct beam impact damage to the work piece
Solution Approach 2:
The deposition process is segmented into two separate steps: first, material is deposited onto the sputter source by the charged particle beam; second, the material is transferred from the sputter source to the work piece. This segmentation allows the beam to act on the sputter source rather than directly on the work piece, reducing damage
2Object-affected harmful factors
If an electron beam is used to deposit material, then less surface damage occurs, but the system cost increases
Solution Approach 1:
The sputter source serves multiple functions: it acts as a material reservoir, a deposition substrate for the charged particle beam, and a transfer medium to the work piece. This multi-functionality allows the system to achieve low-damage deposition using existing ion beam infrastructure rather than requiring separate electron beam equipment
Solution Approach 2:
The sputter source material is deposited and transferred using the existing charged particle beam system's own capabilities, eliminating the need for additional specialized equipment like electron beam depositors. The system uses its existing beam to service the dual purpose of source preparation and work piece coating
3Quantity of substance
If the work piece is moved between sputter system and charged particle beam system, then coating can be applied, but processing time increases
Solution Approach 1:
The sputter source and work piece are positioned within the same vacuum chamber, allowing simultaneous or sequential processing of both components without breaking vacuum or moving the work piece between systems. The charged particle beam processes both the sputter source and the work piece in one integrated operation
Solution Approach 2:
The sputter source is prepared in advance within the same chamber, and the work piece is already in position, eliminating the need for intermediate handling and transport steps that would consume time and risk contamination
4Reliability
If a conductive layer is deposited to reduce charging, then charge control improves, but the work piece may still accumulate charge during processing
Solution Approach 1:
The surface properties of the work piece are changed by depositing a conductive or semi-conductive layer that modifies the electrical characteristics. This layer provides charge dissipation pathways that prevent excessive charge accumulation during charged particle beam processing, improving reliability
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach protects the work piece surface from damage, reduces charging effects, and allows for precise, cost-effective sputter coating in existing charged particle beam systems, enhancing resolution and charge control without the need for additional plasma-type sputtering systems, suitable for various materials including low-k dielectrics and photoresists.
Implementation Method 1
A charged particle beam is directed toward a source material to sputter the material from the source material onto the work piece surface
Data Source
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AI summary
A coating is applied to a work piece (222) in a charged particle beam system (200) without directing the beam (218) to the work piece. The coating is applied by sputtering, either within the charged particle beam vacuum chamber (226) or outside the charged particle beam vacuum chamber. In one embodiment, the sputtering is performed by directing the charged particle beam (218) to a sputter material source (242), such as a needle (240) from a gas injection system. Material is sputtered from the sputter material source onto the work piece to form, for example, a protective or conductive coating, without requiring the beam to be directed to the work piece, thereby reducing or eliminating damage to the work piece.