Beamforming Chip-Antenna Package With Matching Circuits for Low-Loss Links
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Solution Overview
Problem
Existing multi-channel beamforming technologies face challenges in efficiently transmitting signals over long distances with minimal signal loss, particularly in high-frequency bands such as sub-terahertz frequencies.
Innovation Solution
A multi-channel beamforming chip-antenna package is developed, incorporating a multi-channel beamforming chip, waveguides, and coupling circuits that include matching and converting circuits. These circuits utilize bond wires, microstrip lines, and waveguides to efficiently combine and transmit signals, minimizing signal loss.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If conventional packaging methods are used for high-frequency beamforming, then device complexity is reduced, but signal loss increases and transmission distance is limited
Solution Approach 1:
The patent combines the beamforming chip and antenna into a single integrated package structure, eliminating the need for separate packaging. The chip is directly mounted on the antenna substrate with coupling circuits formed on the same substrate, creating a unified chip-antenna package that reduces signal loss while managing complexity through integration
Solution Approach 2:
The patent introduces coupling circuits as intermediary components between the beamforming chip and antenna. These coupling circuits include matching circuits and converting circuits that act as mediators to efficiently transfer signals between different impedance environments, reducing signal loss at interfaces
2Loss of energy
If connection distance between chip and antenna is increased, then ease of manufacture is improved, but signal loss increases
Solution Approach 1:
The patent segments the connection path into distinct functional sections: bond wire connections from chip pads to coupling circuit input pads, microstrip line transmission paths through the substrate, and coupling circuit interfaces. This segmentation allows each section to be optimized independently for both signal performance and manufacturability
Solution Approach 2:
The coupling circuits are pre-formed on the antenna substrate before chip mounting. The matching and converting circuits are fabricated in advance with precise impedance control, allowing the chip to be directly connected without requiring post-assembly tuning or adjustment, thus reducing signal loss while maintaining ease of manufacture
3Loss of energy
If impedance matching is not optimized, then device complexity is reduced, but signal loss increases
Solution Approach 1:
The patent introduces matching circuits as intermediary components that perform impedance transformation between the bond wire connections and microstrip lines. These matching circuits include inductance and capacitance components that act as mediators to bridge impedance mismatches, reducing signal loss without requiring complex external matching networks
Solution Approach 2:
The patent employs parameter changes in the coupling circuits, specifically varying the width of microstrip lines and the values of inductance and capacitance components to achieve impedance matching. By adjusting these parameters during design, the circuits are optimized for minimal signal loss while maintaining manageable complexity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The proposed solution enables efficient long-distance signal transmission with low signal loss, effectively addressing the limitations of existing technologies in high-frequency bands.
Implementation Method 1
combining a plurality of channels of a multi-channel beamforming chip and a matching circuit using a bond wire
Implementation Method 2
combining the matching circuit and a converting circuit using a microstrip line
Implementation Method 3
combining the converting circuit and a plurality of waveguides
Data Source
AI summary
A multi-channel beamforming chip-antenna package is provided. The multi-channel beamforming chip-antenna package includes a multi-channel beamforming chip including a plurality of channels, a plurality of waveguides, and a plurality of coupling circuits configured to combine the plurality of channels with the plurality of waveguides, wherein each of the plurality of coupling circuits may include a matching circuit configured to combine a wire bonded to each of the plurality of channels and a microstrip line and a converting circuit configured to combine the microstrip line and the plurality of waveguides.